Products

BONDiT™ B-482 is a two-part, state-of-the-art 100% solids, room-temperature curing flexible epoxy resin system. Especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, hard coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.

BONDiT™ C-52 is an all-around general purpose, one-part primer, adhesion promoter and adhesive with moderate chemical resistance for metals, glass & ceramics, thermoplastics and thermoset polymers. BONDiT™ C-52 offers a wide range of capabilities for promoting single coat chemical bonding between coatings, sealants and adhesives of very diverse properties to mineral and polymer substrates. It is especially useful as a primer and adhesion promoter for injection molding to metal and glass with polyethylene, polypropylene and polyolefins in general, PPS, PVC, PBT, ABS, polysulfone, polystyrene, polyamide (nylon 6 and 66), polyamide-imide, polyimide, polyvinylbutyral, melamine, polycarbonate, polyester, polyether, phenolic, and epoxy, with molding temperatures up to 328°C/622°F.

BONDiT™ C-6 is an all-around general purpose, one-part primer, adhesion promoter and adhesive with moderate chemical resistance for metals, glass & ceramics, thermoplastics and thermoset polymers. BONDiT™ C-6 offers a wide range of capabilities for promoting single coat chemical bonding between coatings, sealants and adhesives of very diverse properties to mineral and polymer substrates. It is used as a primer coat for other BONDiT™ coatings and encapsulants.

BONDiT™ A-3 is a high performance, high temperature moisture resistant, primer, adhesive, adhesion promoter and additive used with metals, glass & ceramics, elastomers and polymers. BONDiT™ A-3 offers a wide range of capabilities for moisture resistance chemical bonding betweenminerals and polymers, as well as dissimilar polymers. it is used as a primer coat and additive for other BONDiT™ coatings and encapsulants. BONDiT™ A-3 may be used as an additive to other coatings, fiber fills, and adhesives to promote superior improvement in performance in harshenvironments.

BONDiT™ B-4811 is a two-part, state-of-the-art 100% solids, room temperature curing rigid epoxy resin system, especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.

BONDiT™ B-536 is a two-part, very high strength, 100% solids, room-temperature curing semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding to a wide range of engineering plastics, including polyolefin and metals, glass, ceramic, composite and wood. Typical example of lapshear bond strength is 1100 PSI for PEEK-to-PEEK and PEEK-to-Steel substrates. B-536 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, and detergents. B-536 has high thermal stability and offers good corrosion resistance. The semi- flexible properties of B-536 permits assembly of materials with dissimilar thermal expansion and survive thermal cycling. Likewise mechanical vibration, shock and impact are easily absorbed by B-536 and protect surfaces and bonded assemblies.

BONDiT™ A-37 is a high performance, high temperature moisture resistant, primer, adhesive, adhesion promoter and additive used with metals, glass & ceramics, elastomers and polymers. BONDiT™ A-37 offers a wide range of capabilities for promoting moisture resistance chemical bonding between minerals and polymers, as well as dissimilar polymers. it is used as a primer coat and additive for other BONDiT™ coatings and encapsulants. BONDiT™ In particular A-37 may be used as a primer to promote adhesion to silicone rubber and for vulcanizing silicone rubber to many substrates.

BONDiT™ B-521 is a two-part, state-of-the-art 100% solids, elevated-temperature, fast curing, semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding engineering plastics and elastomers to various substrates–particularly rigid substrates such as glass, metals and ceramic, without stress build up and joint or substrate fracture.

BONDiT™ B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.