- Ready to Use Product Type:2K (2 component) Adhesive, Epoxy Adhesive
- Compatible Substrates & Surfaces:Metal, Plastics, Ceramic
- Cure Method:Air Dry
ResinLab® EP1026T3 Part A is a two-part unfilled epoxy adhesive designed for high-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid material. The thixotropic paste consistency prevents running and sagging. This formula will have good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. EP1026T3 CLEAR was formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1026T3 CLEAR will reach handle cure at room temperature within 20-30 minutes and full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly. Times and temperatures are listed below. Time to heat substrate must be considered. Cooler temperatures will also extend work time and increase cure times.