Products

Resinlab® SEC1222 Part A is a silver filled, two component epoxy adhesive designed to cure completely at room temperature. It has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. SEC1222 provides exceptionally high electrical conductivity starting immediately after mixing that improves as the curing process proceeds. It also has the additional benefit of very high thermal conductivity due to its high silver loading. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

ResinLab® RC8038 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8040 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8003 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8035 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® EP1026HP Part A is a high performance fast setting epoxy adhesive designed for bonding metals, ceramics, glass and most plastics. This product will have good resistance to water, salt spray, inorganic acids and bases and most organic solvents.

Resinlab® EP1115 Clear Part A is a two-part unfilled epoxy adhesive designed for bonding metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and bases and most organic solvents. This product will have better water and temperature resistance than standard “5-minute” epoxy adhesives. EP1115 Clear was formulated to a 1A:1B volume mix ratio for use in side by side dispensing cartridges and meter/mix and dispense equipment. A handling cure is normally achieved at room temperature within 1 – 2 hours with full cure properties reached in 24 hours. Cure time can be accelerated by the application of heat to reach final cure properties quickly. Times of 30 minutes at 65 °C to 10 minutes at 100 °C is typical for most applications. Cooler temperatures will extend work time and increase cure times.

Resinlab® EP1056LC Black Part A is a two-part urethane modified epoxy adhesive designed to give good adhesion to metals and hard to bond surfaces such as PVC. It is thixotropic to provide good gap filling ability and prevent running and sagging during cure. It has very good resistance to water, acids and bases and most organic solvents. EP1056LC Black was formulated to a 2A:1B by volume mix ratio for use in side by side dispensing cartridges and meter/mix and dispense equipment. It will reach handle cure at room temperature within 8 – 16 hours. Cure time can be accelerated by the application of heat. Times and temperatures from 2 hours at 65°C to 10 minutes at 100°C are typical for most applications. Time to heat substrate must be taken into account. Cooler temperatures will also extend work time and increase cure times.

ResinLab® EP1026 Clear Part A is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 20-30 minutes with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.

ResinLab® UR7001 Part A is a two-part clear polyester polyurethane designed to provide outstanding adhesion to a variety of plastics, as well as metals. UR7001 Clear provides excellent water and chemical resistance. UR7001 Clear was formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. The product will reach full cure after 24 hours under ambient conditions. The cure can be accelerated through the addition of heat. Cure schedules of 30 minutes at 65°C or 10 minutes at 100°C are sufficient. UR7001 Clear is suitable for use in medical device assembly, it has been tested and is proven non-toxic per ISO 10993-5.

Resinlab® SEC1233 Part A is a silver filled, two component, room temperature curing epoxy adhesive. SEC1233 has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. It also can be packaged in small side-by-side dispensing cartridges for use with static mixers. This system is also available in a pre-mixed and frozen format. SEC1233 provides exceptionally high conductivity starting immediately after mixing and improves during the curing process. It also has high thermal conductivity due to its high silver content. It provides environmental protection and has tenacious adhesion to various metals and other common assembly materials.

ResinLab® UR7024 Part A is a two-part room temperature curing polyurethane adhesive designed to impart exceptional bond strength to polycarbonate. UR7024 Clear bonds and cures quickly to a clear flexible adhesive useful in applications that require tough, impact resistant clear parts and high peel strength. UR7024 Clear can also be used for general purpose adhesive applications and esthetic assemblies. UR7024 Clear was formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. It will reach full cure at room temperature within 24 hours at room temperature. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 30 minutes at 65°C to 15 minutes at 100°C are typical for small castings (less than 50 grams). Time to heat substrate must be taken into account. Cooler temperatures will extend work time and increase cure time.

ResinLab® RC8048 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8041 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® UR7006HV Part A is an industrial grade urethane adhesive. This is a 45,000 cps to 50,000 cps mixed viscosity version of UR7006. This formulation is designed to cure under ambient conditions to form a clear, flexible material with very good adhesion to polycarbonate.

Resinlab® EP1026 Black Part A is a two-part, unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material and is free-flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. EP1026 Black was formulated to a 1A:1B by volume mix ratio for use in either meter/mix and dispense equipment or side-by-side dual cartridges for easy dispensing. Handling cure is normally achieved at room temperature within 20-30 minutes with full cure in 24 hours. Because of the fast and exothermic reaction process, this product should only be used in small volumes.

ResinLab® EP1026T3 Part A is a two-part unfilled epoxy adhesive designed for high-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid material. The thixotropic paste consistency prevents running and sagging. This formula will have good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. EP1026T3 CLEAR was formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1026T3 CLEAR will reach handle cure at room temperature within 20-30 minutes and full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly. Times and temperatures are listed below. Time to heat substrate must be considered. Cooler temperatures will also extend work time and increase cure times.

Resinlab® SEC1244 Part A is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product will cure very quickly at high temperatures. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

ResinLab® RC8009 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.

ResinLab® RC8020 anaerobic retaining compounds are designed for use in demanding applications to fill the spaces and surface irregularities between tightly mated cylindrical parts. These products form a tough permanent bond which greatly enhances the torque and pullout strength. They are single component solvent free materials manufactured in a wide variety of viscosities and setting times to satisfy specific bonding applications. This technology increases the reliability and performance of assemblies while reducing dependence upon maintaining costly tight machining tolerances.