LNP™ THERMOCOMP™ Compound FX10009

Identification & Functionality

Chemical Family

Polyethylenes,

Polyolefins

Fillers Included

Mineral

Polymer Name

Polyethylene (unspecified)

Plastics & Elastomers Functions

Resin

Technologies

Plastics

Product Families

Plastics — Basic Thermoplastics

Polyolefins

Features & Benefits

Materials Features

Cost Effective,

Electrically Conductive,

Excellent Dielectric Properties,

Unreinforced

Thermocomp™ Compounds For Dielectric Solutions

LNP™ THERMOCOMP compounds portfolio contains thermoplastic injection molding materials that offer low Dissipation Factor (Df ) for improved signal gain and longer reading distance paired with tailor made Dielectric Constants (Dk ) to fine tune or detour a signal direction supporting innovative antenna designs. Beyond that, THERMOCOMP compounds allow further antenna miniaturization and the design of phase shifters with higher productivity through combined high Dk and low Df material properties.

Typical Industry Requirements

• Materials for individual antenna design to fine tune or detour signal direction.
• Improved signal gain and longer reading distance through less signal attenuation.
• Miniaturized antenna solutions with sufficient signal strength for 5G technology.
• Improved mechanical performance versus Epoxy or Ceramics in more complex designs for less maintenance through longer lifetime.

Typical Material Characteristics

• Tailored Dielectric Constant Dk by customized compound formulations.
• Very low Dissipation Factor Df for lower signal absorption, less signal scattering.
• Combined high Dk and low Df with very high signal transmission density.
• Sufficient flowability for thin wall design, improved ductility, dimensional and dielectric stability versus current solution.

Applications & Uses

Markets

Automotive & Transportation,

Consumer Goods,

Electrical & Electronics,

Personal Care,

Printing & Packaging

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Interior

Electrical & Electronics — Devices & Assemblies

Consumer Electronics,

Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors,

Housings & Enclosures,

Switches & Relays

Plastics & Elastomers End Uses

Automotive Applications,

Automotive Interior Parts,

Cell Phones,

Computer Components,

Consumer Applications,

Containers,

Displays,

Electrical Components,

Electrical/Electronic Applications,

Enclosure,

Personal Accessories,

Tablets

Plastics & Elastomers Processing Methods

Injection Molding

Properties

Physical Properties

	Value	Units	Test Method / Conditions
Melt Volume Rate (at 190°C, 10.0 kg) ¹¹	7.5	cm³/10 min	ISO 1133
Melt Volume Rate (at 220°C, 10.0 kg) ¹¹	12.5	cm³/10 min	ISO 1133
Mold Shrinkage (flow) ᵍ ¹¹	1.5 - 2	%	SABIC method
Density ¹¹	2.5	g/cm³	ISO 1183
Water Absorption (at 23°C, 24hrs) ¹¹	0.08	%	ISO 62-1

Mechanical Properties

	Value	Units	Test Method / Conditions
Tensile Stress (Break, 5 mm/min) ¹¹	20	MPa	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	1.2	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	2550	MPa	ISO 527
Flexural Stress (Break, 2 mm/min) ¹¹	15	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	2750	MPa	ISO 178

Thermal Properties

	Value	Units	Test Method / Conditions
Coefficient of Thermal Expansion (at 23°C to 60°C, flow) ¹¹	0.00013	1/°C	ISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 60°C, xflow) ¹¹	0.00015	1/°C	ISO 11359-2
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹	100	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹	60	°C	ISO 75/Af

Electrical Properties

	Value	Units	Test Method / Conditions
Dissipation Factor (at 100 MHz) ¹¹	0.009	—	IEC 60250
Dissipation Factor (at 500 MHz) ¹¹	0.008	—	IEC 60250
Dissipation Factor (at at 1 GHz) ¹¹	0.008	—	IEC 60250
Relative Permittivity (1 GHz) ¹¹	13.1	—	IEC 60250
Relative Permittivity (100 MHz) ¹¹	13.6	—	IEC 60250
Relative Permittivity (500 MHz) ¹¹	13.4	—	IEC 60250

Impact Properties

	Value	Units	Test Method / Conditions
Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹	5.5	kJ/m²	ISO 180/1U
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹	3.5	kJ/m²	ISO 180/1A

Injection Molding

	Value	Units	Test Method / Conditions
Drying Temperature ⁷	80	°C	—
Drying Time ⁷	4	Hrs	—
Maximum Moisture Content ⁷	0.03	%	—
Melt Temperature ⁷	210 - 215	°C	—
Front - Zone 3 Temperature ⁷	205 - 215	°C	—
Middle - Zone 2 Temperature ⁷	200 - 210	°C	—
Rear - Zone 1 Temperature ⁷	190 - 200	°C	—
Mold Temperature ⁷	15 - 55	°C	—
Back Pressure ⁷	0.2 - 0.3	MPa	—
Screw Speed ⁷	30 - 60	rpm	—

Note

• ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.
• ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
• ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

 

Technical Details & Test Data

Typical Properties of Thermocomp Compounds for Dielectric Solutions

Packaging & Availability

Country Availability

Canada,

China (Mainland),

Mexico,

USA

Regional Availability

• Americas
• Asia
• Europe
• North America