LNP THERMOCOMP™ Compound - MX89510 - SABIC's Specialty

Identification & Functionality

Features & Benefits

Materials Features: Cost Effective,
Dimensional Stability,
Good Mold Release,
High Stiffness,
Low Warpage

Applications & Uses

Markets: Consumer Goods,
Electrical & Electronics,
Personal Care,
Printing & Packaging
Applications: Consumer Goods — Appliances & Electronics
Electrical & Electronics — Devices & Assemblies
Consumer Electronics,
Displays
Printing & Packaging — Packaging
Non-Food Consumer Packaging
Personal Care — Packaging & Accessories
Applicators & Accessories
Electrical & Electronics — Parts & Components
Connectors,
Switches & Relays
Consumer Goods — Sports & Recreation
Plastics & Elastomers End Uses: Cell Phones,
Computer Components,
Consumer Applications,
Containers,
Displays,
Electrical Components,
Electrical/Electronic Applications,
Personal Accessories,
Sporting Goods,
Tablets
Plastics & Elastomers Processing Methods: Injection Molding

Properties

Mechanical Properties
Physical Properties
Thermal Properties
Impact Properties
Injection Molding
Note: ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.

⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.

¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

	Value	Units	Test Method / Conditions
Tensile Stress (Yield, Type I, 5 mm/min) ¹¹	52	MPa	ASTM D638
Tensile Stress (Break, Type I, 5 mm/min) ¹¹	52	MPa	ASTM D638
Tensile Strain (Yield, Type I, 5 mm/min) ¹¹	3	%	ASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹	3.4	%	ASTM D638
Tensile Modulus (at 50 mm/min) ¹¹	3820	MPa	ASTM D638
Flexural Stress (Yield, 1.3 mm/min, 50 mm span) ¹¹	80	MPa	ASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹	2800	MPa	ASTM D790
Tensile Stress (Yield, 5 mm/min) ¹¹	50	MPa	ISO 527
Tensile Stress (Break, 5 mm/min) ¹¹	48	MPa	ISO 527
Tensile Strain (Yield, 5 mm/min) ¹¹	2.9	%	ISO 527
Tensile Strain (Break, 5 mm/min) ¹¹	3.4	%	ISO 527
Tensile Modulus (at 1 mm/min) ¹¹	3540	MPa	ISO 527
Flexural Stress ¹¹	76	MPa	ISO 178
Flexural Modulus (at 2 mm/min) ¹¹	2950	MPa	ISO 178

	Value	Units	Test Method / Conditions
Specific Gravity ¹¹	1.02	—	ASTM D792
Density ¹¹	1.01	g/cm³	ASTM D792
Moisture Absorption (at 23°C, 50% RH, 24hrs) ¹¹	2.00E-02	%	ASTM D570
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.8 - 2	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.9 - 3	%	ASTM D955
Moisture Absorption (at 23°C, 50% RH) ¹¹	0.02	%	ISO 62

	Value	Units	Test Method / Conditions
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	156	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	131	°C	ASTM D648
Coefficient of Thermal Expansion (at -30°C to 30°C, flow) ¹¹	0.000043	1/°C	ASTM D696
Coefficient of Thermal Expansion (at -30°C to 30°C, xflow) ¹¹	0.00012	1/°C	ASTM D696
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80104, sp=64mm) ¹¹	153	°C	ISO 75/Bf
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80104, sp=64mm) ¹¹	119	°C	ISO 75/Af

	Value	Units	Test Method / Conditions
Izod Impact (Unnotched, at 23°C) ¹¹	368	J/m	ASTM D4812
Izod Impact (Notched, at 23°C) ¹¹	21	J/m	ASTM D256
Multi-Axial Impact ¹¹	1	J	ISO 6603
Instrumented Dart Impact Total Energy (at 23°C) ¹¹	4	J	ASTM D3763
Izod Impact (Unnotched, 80104, at 23°C) ¹¹	22	kJ/m²	ISO 180/1U
Izod Impact (Notched, 80104, at 23°C) ¹¹	2	kJ/m²	ISO 180/1A

Packaging & Availability

LNP™ THERMOCOMP™ Compound MX89510