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LNP™ THERMOCOMP™ Compound ZX08005

1 of 486 products in this brand
LNP THERMOCOMP ZX08005 compound is based on Polyphenylene Ether / Polystyrene (PPE/PS) blend containing unreinforced. Added features of this grade include: Improved Dielectric Properties.

Polymer Name: PPO/PS Alloy

Processing Methods: Injection Molding

Density: 2070.0 - 2070.0 kg/m³

Flexural Modulus: 4600.0 - 4600.0 MPa

Technical Data Sheet

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Thermocomp™ Compounds For Dielectric Solutions

LNP™ THERMOCOMP compounds portfolio contains thermoplastic injection molding materials that offer low Dissipation Factor (Df ) for improved signal gain and longer reading distance paired with tailor made Dielectric Constants (Dk ) to fine tune or detour a signal direction supporting innovative antenna designs. Beyond that, THERMOCOMP compounds allow further antenna miniaturization and the design of phase shifters with higher productivity through combined high Dk and low Df material properties.

Typical Industry Requirements

  • Materials for individual antenna design to fine tune or detour signal direction.
  • Improved signal gain and longer reading distance through less signal attenuation.
  • Miniaturized antenna solutions with sufficient signal strength for 5G technology.
  • Improved mechanical performance versus Epoxy or Ceramics in more complex designs for less maintenance through longer lifetime.

Typical Material Characteristics

  • Tailored Dielectric Constant Dk by customized compound formulations.
  • Very low Dissipation Factor Df for lower signal absorption, less signal scattering.
  • Combined high Dk and low Df with very high signal transmission density.
  • Sufficient flowability for thin wall design, improved ductility, dimensional and dielectric stability versus current solution.

Applications & Uses

Plastics & Elastomers Processing Methods

Properties

Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Stress (Yield, 5 mm/min) ¹¹55MPaISO 527
Tensile Strain (Break, 5 mm/min) ¹¹4.4%ISO 527
Tensile Modulus (at 1 mm/min) ¹¹3400MPaISO 527
Flexural Stress (Yield, at 2 mm/min) ¹¹105MPaISO 178
Flexural Modulus (at 2 mm/min) ¹¹4600MPaISO 178
Physical Properties
ValueUnitsTest Method / Conditions
Density ¹¹2.07g/cm³ISO 1183
Thermal Properties
ValueUnitsTest Method / Conditions
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹140°CASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹130°CASTM D648
Electrical Properties
ValueUnitsTest Method / Conditions
Relative Permittivity (100 MHz) ¹¹6.58IEC 60250
Relative Permittivity (500 MHz) ¹¹6.47IEC 60250
Relative Permittivity (1 GHz) ¹¹6.16IEC 60250
Dissipation Factor (at 500 MHz) ¹¹0.001IEC 60250
Dissipation Factor (at at 1 GHz) ¹¹0.001IEC 60250
Dissipation Factor (at 100 MHz) ¹¹0.001IEC 60250
Impact Properties
ValueUnitsTest Method / Conditions
Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹17kJ/m²ISO 180/1U
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹5kJ/m²ISO 180/1A
Injection Molding
ValueUnitsTest Method / Conditions
Drying Temperature ⁷120°C
Drying Time ⁷4Hrs
Melt Temperature ⁷300 - 305°C
Front - Zone 3 Temperature ⁷300 - 310°C
Middle - Zone 2 Temperature ⁷290 - 300°C
Rear - Zone 1 Temperature ⁷275 - 290°C
Mold Temperature ⁷80 - 110°C
Back Pressure ⁷0.2 - 0.3MPa
Screw Speed ⁷30 - 60rpm
Note
  • ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
  • ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
 

Technical Details & Test Data

Typical Properties of Thermocomp Compounds for Dielectric Solutions

LNP™ THERMOCOMP™ Compound ZX08005 - Typical Properties of Thermocomp Compounds For Dielectric Solutions

Packaging & Availability

Regional Availability
  • Americas
  • Asia
  • Europe
  • North America