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LNP™ THERMOTUF™ Compound WF006NiQ

1 of 51 products in this brand
SABIC's Specialties Business LNP™ THERMOTUF™ Compound WF006NiQ is a high-quality material based on polybutylene terephthalate (PBT) resin that utilizes ELCRIN iQ upcycling technology and contains 30% glass fiber. This grade is impact modified, has high flow, good metal bonding strength, and good chemical resistance, making it suitable for nano-molding technology (NMT) applications. It also contains more than 25% post-consumer recycled content, making it an eco-friendly choice for manufacturers. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

Polymer Name: Polybutylene Terephthalate (PBT)

Additives Included: Impact Modifier

Fillers Included: Glass Fiber

Labeling Claims: Contains PCR Resin, No Added PFAS, Recycled, Sustainable

Processing Methods: Injection Molding

Density: 1490.0 - 1490.0 kg/m³

Technical Data Sheet

Knowde Enhanced TDS

Identification & Functionality

Additives Included
Chemical Family
Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Introduction

LNP THERMOTUF WF006NIQ Is a 30% glass fiber reinforced PBT compound with 25% PCR content, used for NMT applications requiring sustainability concept.

Value Proposition

  • 25% PCR content
  • Comparable properties as virgin WF006N
  • Good warpage control
  • Good color-stability

Applications & Uses

Plastics & Elastomers Processing Methods
Potential Applications

PBT based LNP THERMOTUF™ compounds may be qualified to use in consumer electronics and consumer applications for combination of dimensional stability, mechanical performance and bonding strength.

Properties

Flame Rating
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Stress (Break, Type I, 5 mm/min) ¹¹110MPaASTM D638
Tensile Strain (Break, Type I, 5 mm/min) ¹¹2.5%ASTM D638
Tensile Modulus (at 5 mm/min) ¹¹8760MPaASTM D638
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹170MPaASTM D790
Flexural Modulus (at 1.3 mm/min, 50 mm span) ¹¹7.70E+03MPaASTM D790
Tensile Stress (Break, 5 mm/min) ¹¹111MPaISO 527
Tensile Strain (Break, 5 mm/min) ¹¹2.5%ISO 527
Tensile Modulus (at 1 mm/min) ¹¹8600MPaISO 527
Flexural Stress (Break, 2 mm/min) ¹¹168MPaISO 178
Flexural Modulus (at 2 mm/min) ¹¹7100MPaISO 178
Bonding Strength ("T" treatment, Shear type) ¹¹33MPaISO 19095
Physical Properties
ValueUnitsTest Method / Conditions
Density ¹¹1.49g/cm³ISO 1183
Melt Flow Rate (at 250°C, 5 kgf) ¹¹21g/10 minASTM D1238
Melt Flow Rate (at 275°C, 5 kgf) ¹¹37g/10 minASTM D1238
Melt Volume Rate (at 250°C, 5 kg) ¹¹15cm³/10 minISO 1133
Melt Volume Rate (at 275°C, 5 kg) ¹¹29cm³/10 minISO 1133
Melt Volume Rate (at 270°C, 5 kg) ¹¹23cm³/10 minISO 1133
Mold Shrinkage (flow) ᵍ ¹¹0.2 - 0.3%SABIC method
Mold Shrinkage (xflow) ᵍ ¹¹0.4 - 0.5%SABIC method
Thermal Properties
ValueUnitsTest Method / Conditions
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹162°CASTM D648
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹204°CASTM D648
Heat Deflection Temperature/Af (at 1.8 Mpa, Flatw 80*10*4, sp=64mm) ¹¹156°CISO 75/Af
Heat Deflection Temperature/Bf (at 0.45 Mpa, Flatw 80*10*4, sp=64mm) ¹¹200°CISO 75/Bf
Coefficient of Thermal Expansion (at 23°C to 50°C, flow) ¹¹0.0000241/°CASTM E831
Coefficient of Thermal Expansion (at 23°C to 50°C, flow) ¹¹0.0000231/°CISO 11359-2
Coefficient of Thermal Expansion (at 23°C to 50°C, xflow) ¹¹0.000091/°CASTM E831
Coefficient of Thermal Expansion (at 23°C to 50°C, xflow) ¹¹0.0000961/°CISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹0.0000241/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, flow) ¹¹0.0000231/°CISO 11359-2
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹0.0000811/°CASTM E831
Coefficient of Thermal Expansion (at -40°C to 40°C, xflow) ¹¹0.0000861/°CISO 11359-2
Relative Temperature Index (Electrical) ᵖ ¹¹75°CUL 746B
Relative Temperature Index (Mechanical with impact) ᵖ ¹¹75°CUL 746B
Relative Temperature Index (Mechanical without impact) ᵖ ¹¹75°CUL 746B
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Constant (at 1.1 GHz) ¹¹3.61SABIC method
Dissipation Factor (at 1.1 GHz) ¹¹0.013SABIC method
Dielectric Constant (at 1.9 GHz) ¹¹3.62SABIC method
Dissipation Factor (at 1.9 GHz) ¹¹0.012SABIC method
Dielectric Constant (at 5 GHz) ¹¹3.59SABIC method
Dissipation Factor (at 5 GHz) ¹¹0.01SABIC method
Dielectric Constant (at 10 GHz) ¹¹3.53SABIC method
Dissipation Factor (at 10 GHz) ¹¹0.009SABIC method
Impact Properties
ValueUnitsTest Method / Conditions
Izod Impact (Unnotched, at 23°C) ¹¹870J/mASTM D4812
Izod Impact (Notched, at 23°C) ¹¹137J/mASTM D256
Izod Impact (Notched, at -30°C) ¹¹100J/mASTM D256
Izod Impact (Unnotched, 80*10*4, at 23°C) ¹¹54kJ/m²ISO 180/1U
Izod Impact (Notched, 80*10*4, at 23°C) ¹¹13kJ/m²ISO 180/1A
Izod Impact (Notched, 80*10*4, at -30°C) ¹¹10kJ/m²ISO 180/1A
Injection Molding
ValueUnitsTest Method / Conditions
Drying Temperature ⁷100 - 120°C
Drying Time ⁷2 - 4Hrs
Drying Time (Cumulative) ⁷8Hrs
Maximum Moisture Content ⁷0.02%
Melt Temperature ⁷250 - 270°C
Nozzle Temperature ⁷245 - 275°C
Front - Zone 3 Temperature ⁷250 - 270°C
Middle - Zone 2 Temperature ⁷250 - 270°C
Rear - Zone 1 Temperature ⁷240 - 260°C
Hopper Temperature ⁷40 - 60°C
Mold Temperature ˡ ⁷100 - 160°C
Flame Characteristics
ValueUnitsTest Method / Conditions
UL Recognized (94HB Flame Class Rating) ᵖmin. 0.7mmUL 94
Note
  • ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.
  • ᵖ UL ratings shown on the technical datasheet might not cover the full range of thicknesses and colors. For details, please see the UL Yellow Card.
  • ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
  • ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.
 

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Regional Availability
  • Americas
  • Asia
  • Europe
  • North America