Swancor 2564

SWANCOR 2564 is a hot-melt epoxy resin and does not contain Diuron and volatile ingredients. Suitable for molding process, with good surface adhesion and spreadability.

Polymer Name: Epoxy Resins & Compounds

Chemical Family: Epoxy & Epoxy Derivatives

End Uses: Helmets

Similar Products

jER™ YL980
Applications:
Electronics Adhesives, Semiconductor Manufacturing, Appliances & Electronics, Potting Compounds, Other Packaging & Assembly Applications, Other Devices & Assemblies, Printed Circuit Boards (PCBs), Other Paints & Coatings Applications, Adhesives & Sealants, Other Building & Construction Applications, Other Adhesives & Sealants Applications, Industrial & Assembly Adhesives, Devices & Assemblies, Packaging & Assembly, Parts & Components
Product Families:
Functional Additives, Epoxies, Thermoset Resins, Additives, Resins & Binders, Polymers & Resins
Chemical Family:
Bisphenol Epoxy Resins, Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives
jER™ YL983U
Applications:
Electronics Adhesives, Semiconductor Manufacturing, Appliances & Electronics, Potting Compounds, Other Packaging & Assembly Applications, Other Devices & Assemblies, Printed Circuit Boards (PCBs), Other Paints & Coatings Applications, Adhesives & Sealants, Other Building & Construction Applications, Other Adhesives & Sealants Applications, Industrial & Assembly Adhesives, Devices & Assemblies, Packaging & Assembly, Parts & Components
Product Families:
Functional Additives, Epoxies, Thermoset Resins, Additives, Resins & Binders, Polymers & Resins
Chemical Family:
Bisphenol Epoxy Resins, Bisphenol F Type Epoxy, Epoxy & Epoxy Derivatives
jER™ YX7400N
Applications:
Electronics Adhesives, Adhesives & Sealants, Printed Circuit Boards (PCBs), Potting Compounds, Semiconductor Manufacturing, Electronics Coatings, Appliances & Electronics, Industrial & Assembly Adhesives, Packaging & Assembly, Parts & Components, Specialty Coatings
Product Families:
Functional Additives, Epoxies, Thermoset Resins, Additives, Resins & Binders, Polymers & Resins
Chemical Family:
Epoxy & Epoxy Derivatives
jER™ YX8000D
Applications:
Electronics Adhesives, Other Packaging & Assembly Applications, Semiconductor Manufacturing, Appliances & Electronics, Potting Compounds, Other Devices & Assemblies, Other Paints & Coatings Applications, Adhesives & Sealants, Displays, Other Building & Construction Applications, Other Adhesives & Sealants Applications, Industrial & Assembly Adhesives, Devices & Assemblies, Packaging & Assembly, Parts & Components
Product Families:
Functional Additives, Epoxies, Thermoset Resins, Additives, Resins & Binders, Polymers & Resins
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol A Type Epoxy
jER™ YX4000
Applications:
Electronics Adhesives, Semiconductor Manufacturing, Electronics Coatings, Appliances & Electronics, Other Paints & Coatings Applications, Printed Circuit Boards (PCBs), Adhesives & Sealants, Other Building & Construction Applications, Other Adhesives & Sealants Applications, Industrial & Assembly Adhesives, Packaging & Assembly, Parts & Components, Specialty Coatings
Product Families:
Epoxies, Thermoset Resins, Resins & Binders, Polymers & Resins
Chemical Family:
Epoxy & Epoxy Derivatives
jER™ YX7105
Applications:
Semiconductor Manufacturing, Electronics Coatings, Appliances & Electronics, Consumer Electronics, Printed Circuit Boards (PCBs), Other Devices & Assemblies, Other Packaging & Assembly Applications, Potting Compounds, Other Paints & Coatings Applications, Adhesives & Sealants, Devices & Assemblies, Packaging & Assembly, Parts & Components, Specialty Coatings
Product Families:
Functional Additives, Epoxies, Thermoset Resins, Resins & Binders, Additives, Polymers & Resins
Chemical Family:
Epoxy & Epoxy Derivatives

Knowde Enhanced TDS

Identification & Functionality

Chemical Family: Epoxy & Epoxy Derivatives
Polymer Name: Epoxy Resins & Compounds
Composite Materials Functions: Resins, Binders & Matrix Materials
Technologies: Composite Materials,
Plastics
Product Families: Composite Materials — Polymers & Resins
Thermoset Resins
Plastics — Thermoset Resins
Epoxies

Features & Benefits

Labeling Claims: Diuron-Free,
VOC-free
Materials Features: Good Adhesion,
Good Moldability,
Light Weight

Applications & Uses

Markets: Consumer Goods,
Healthcare & Pharma,
Industrial
Applications: Industrial — Chemical & Industrial Manufacturing
Other Industrial Applications
Healthcare & Pharma — Medical
Medical Devices & Assemblies
Consumer Goods — Sports & Recreation
Composites End Use: Helmets
Uses: Used in sports equipment, automobile industry, medical industry and safety helmets, etc. industry

Properties

Typical Properties

	Value	Units	Test Method / Conditions
Type	Hot melt type	-	-
Glass Transition Temperature	120	°C	-
Fluidity	In	-	-
Curing Time in Minutes at120°C (150°C)	120 (60)	-	-

Swancor 2564

Similar Products

jER™ YL980

jER™ YL983U

jER™ YX7400N

jER™ YX8000D

jER™ YX4000

jER™ YX7105

Knowde Enhanced TDS