Products in Devices & Assemblies: Prepreg

Resinoid 1371 is a glass reinforced, two-step phenolic molding compound offering good mechanical and electrical properties. This product has been specifically formulated for applications requiring prolonged exposure to elevated temperatures andresistance to thermal shocks.This material comes in pelletized from and is suitable for injection, transfer or compression molding. It can be preformed on automatic equipment.

85N is the ultimate polyimide and laminate prepreg system fo PWB's requiring resistance to high temperature, both in process and in end-use applications. Bromine-free chemistry provides Bestin-Class thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications.

84N is a high performance ceramic-filled polyimide prepreg based on Arlon’s 85N pure polyimide system, designed for use in filling etched areas in polyimide multilayers that contain thick copper layers and for filling clearance holes in metal cores. The ceramic filler in the resin serves to reduce shrinkage and inhibit crack formulation during through-hole drilling in filled clearance areas.

Resinoid 1505 is a milled glass reinforced, two-step phenolic molding compound offering good mechanical and electrical properties. This product has been specifically formulated for electrical applications where very low post-molded shrinkage is desired. This material comes in granular form and is suitable for injection, transfer or compression molding. It can be preformed on automatic equipment.

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between - 55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials. I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

Resinoid 1382 is a glass reinforced, two-step phenolic molding compound formulated for applications requiring exceptional tensile strength. It has been used to replace cast aluminum in certain applications. Resinoid 1382 exhibits excellent dimensional stability, electrical and thermal properties. It is supplied in pelletized form for use in injection, transfer, and compression molding. It can be preformed on automatic equipment.

Resinoid 1365 is a glass reinforced, two-step phenolic molding compound offering excellent mechanical strength as well as good electrical and thermal characteristics. This material is offered as a moderate size pellet suitable for compression and transfer molding. It can be used in injection molding systems with deep flight screws.

FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imageable solder mask imaging.

38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

Resinoid 1328 is a glass reinforced, two-step phenolic molding compound. It was specifically developed for applications requiring exceptional tensile strength such as grinding wheels. Resinoid 1328 exhibits excellent electrical and thermal properties as well as dimensional stability. This material comes in pelletized from and is suitable for injection, transfer or compression molding. It can be preformed on automatic equipment.

TerraGreen® is engineered for such high-performance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen ® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz. TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs. TerraGreen® meets UL 94 V-0 and is halogen free.

Resinoid 1550 is a milled glass and mineral reinforced, two-step phenolic molding compound offering good mechanical properties. This product has been specifically formulated at a 2.47 specific gravity. This material comes in pelletized form and is suitable for injection, transfer or compression molding. It can be preformed on automatic equipment.

Resinoid 1360HR is a glass reinforced, two-step phenolic molding compound. It exhibits outstanding impact strength, electrical and thermal properties. It is particularly suitable for high temperature and strength applications. This material comes in pelletized from and is suitable for transfer or compression molding. It can be preformed on automatic equipment.

I-Speed® laminate and prepreg products are manufactured with Isolas' patentable high performance multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective. The I-Speed® resin system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imageable solder mask imaging.

PREGNIT TP-PC is a transparent, dimensionally stable, impact resistant, flame retardant possible according to UL94-VO, printable.

FR408 low dielectric constant (Dk) and low dissipation factor (Df) make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. FR408 is compatible with most FR-4 processes. This feature allows the use of FR408 without adding complexity to current fabrication techniques.

Durcomp TPP: Thermoplastic Prepregs is unidirectional, continuous fiber reinforced thermoplastic prepregs with different fiber and resin options, provides mechanical strength, chemical resistance, esthetic appearance etc. of railway vehicle, automotive, white goods, electronics, sports and hobby industries such as the variety to meet the expectations. We support our business partners with solutions aimed at the end use, as well as the production of semi-finished products in the form of unidirectional tape, woven / laminated sheets.

37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.

CM 15 is a Visual composites, Semi Structural and Fast Isothermally Press Curable, Class A Surface quality for painting, Hot Demoldable, Improved UV and environmental resistance, Improved fiber imprinting resistance

Resinoid Compound 1322 is a glass reinforced, two step molding compound. It may be preformed. Recommended for transfer, injection or compression molding

Resinoid 1528 is a glass and mineral reinforced, two-step phenolic molding compound offering good mechanical properties. This product has been specifically formulated for use in automotive applications. This material comes in pelletized form and is suitable for injection, transfer or compression molding. It can be preformed on automatic equipment

P25N consist of a polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of Methylenedianiline (MDA). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

CM11 resin is Mid Tg and its prepregs are suitable for hot painting, hot gluing and cataphoresis processes. New resin system not only cures under 3 minutes at 150°C at press under isothermal curing conditions but also hot de-moldable and long out-life of two weeks at ambient temperature. These extreme conditions does not affect the visual Performance of prepreg system with CM11, capable of Class A Surface. Drapability is suitable for press molds and low to medium tack optimized for press curing.

CM14 resin is Mid Tg fast cure press curable prepreg system which is also dicy free formulated against waterspot/whitespot problems. CM14 resin system is especially formulated for cosmetic grade visual carbon look. Drapability is suitable for press molds and low to medium tack optimized for press curing.

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

OM13 is a structural resin system. It is translucent when cured.

Arlon 85HP’s unique blend of pure polyimide resin and micro-fi ne proprietary fi llers results in superior performance for demanding applications. Compared to conventional polyimide systems, 85HP has a lower Z-axis expansion and twice the thermal conductivity. 85HP reduces resin cracking and wicking in designs with high density plated through holes and vias. 85HP prepreg has resin fl ow characteristics and pressed thickness matching standard polyimides.

OM15 is for visual applications. It is translucent when cured without any white washes. It is Low Tg , about 110 °C.

Resinoid 1345 is a glass reinforced, two-step phenolic molding compound. It was specifically developed for molded electric motor commutators where performance for prolonged periods at elevated temperatures while under centrifugal loads is critical.This material comes in pelletized from and is suitable for injection, transfer or compression molding.

35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring operation at RF/Microwave frequencies. Polyimide Quartz materials also exhibit reduced in-plane CTE for expansion matched SMT applications.

370HR laminates and prepregs, deigned by Polyclad, are made using a patented high performance 180°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. We manufacture 370HR laminates and prepregs with high quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance. 370HR provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials. 370HR is used in thousands of PWB designs and has proven to be best in class for thermal reliability, CAF performance, ease of processing and proven performance on sequential lamination designs.

185HR laminate and prepreg materials are manufactured using Isola’s patented technology, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 340°C decomposition temperature, a lower Z-axis expansion and offers lower loss compared to competitive products in this space. The 185HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and phot imageable solder mask imaging.