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Potting Compounds
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506 Products found in Potting Compounds
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Dar-Tech Inc.
IMSIL® A-30
Chemical Family:
Silica
Functions:
Filler
End Uses:
Solventborne Coating, Waterborne Coating, Primer
Particle Size:
8.1 - 8.1 microns
Oil Absorption:
28.0 - 28.0 g/100 g
IMSIL® A-30 is a microcrystalline silica filler that is produced from an inert, naturally occurring alpha quartz with a unique grape-like morphology. Easily wetted and dispersed in either solvent or water-based systems, IMSIL® is selected for its excellent tint retention, durability over prolonged exposure, and resistance to dirt and weathering.
Dar-Tech Inc.
Portaflame® SG10 LV-01
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Flame Retardant, Filler
Chemical Family:
Aluminum Compounds
Labeling Claims:
Halogen-free, SVHC Chemicals-free
Portaflame® SG10 LV-01 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
Portaflame® SG 55 LV
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Flame Retardant, Filler
Chemical Family:
Aluminum Compounds
Labeling Claims:
Halogen-free, SVHC Chemicals-free
Portaflame® SG 55 LV are produced from carefully selected, synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG LV is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation. Portaflame® SG LV are "low viscosity" optimized grades with exceptional low oil absorption values, giving the formulator the opportunity to achieve higher loading levels. It is used to make flame retardant aluminum sandwich panels.
Dar-Tech Inc.
Portaflame® SG 55
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Filler, Flame Retardant
Chemical Family:
Aluminum Compounds
Labeling Claims:
Halogen-free, SVHC Chemicals-free, High Purity
Portaflame® SG 55 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
Portaflame® SG 200
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Filler, Flame Retardant
Chemical Family:
Aluminum Compounds
Labeling Claims:
Halogen-free, SVHC Chemicals-free, High Purity
Portaflame® SG 200 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
IMSIL® A-75
Chemical Family:
Silica
Functions:
Filler
End Uses:
Solventborne Coating, Waterborne Coating, Primer
Particle Size:
11.3 - 11.3 microns
Oil Absorption:
27.0 - 27.0 g/100 g
IMSIL® A-75 is a microcrystalline silica filler that is produced from an inert, naturally occurring alpha quartz with a unique grape-like morphology. Easily wetted and dispersed in either solvent or water-based systems, IMSIL® is selected for its excellent tint retention, durability over prolonged exposure, and resistance to dirt and weathering.
Dar-Tech Inc.
Portaflame® SG 30 LV
Chemical Name:
Alumina Trihydrate (ATH)
Chemical Family:
Aluminum Compounds
Functions:
Filler, Flame Retardant
Labeling Claims:
Halogen-free, SVHC Chemicals-free, High Purity
Portaflame® SG 30 LV is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG 30 LV is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation. Portaflame® SG 30 LV is a "low viscosity" optimized grade with an exceptional low oil absorption value, giving the formulator the opportunity to achieve higher loading levels. Portaflame® SG 30 LV makes formulations that are flame retardant.
Dar-Tech Inc.
Portaflame® SG 50
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Flame Retardant, Filler
Chemical Family:
Aluminum Compounds
Labeling Claims:
Halogen-free, SVHC Chemicals-free
Portaflame® SG 50 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
Boratherm™ SG200 E
Chemical Name:
Alumina Trihydrate (ATH)
CAS Number:
21645-51-2
Chemical Family:
Aluminum Compounds
Applicable Processes:
Electronics Encapsulation, EV Battery Heat Management
Boratherm™ SG200 E is produced from carefully selected synthetic aluminum hydroxide (ATH). Boratherm™ SG-E grades are used in various applications because of their high thermal conductivity, flame retardancy, smoke suppression, and low viscosity. Combining these grades with finer products (ATH or Al2O3-based) makes it possible to obtain a high packing density, resulting in excellent thermal conductivity. Boratherm™ SG is perfectly suited for formulations needing good flowability. It is specially designed to offer an ultra-low surface area and large particle sizes.
Dar-Tech Inc.
Portaflame® SG 40
Chemical Name:
Alumina Trihydrate (ATH)
Chemical Family:
Aluminum Compounds
Functions:
Flame Retardant, Filler
Labeling Claims:
SVHC Chemicals-free, High Purity, Halogen-free
Portaflame® SG 40 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
Portaflame® SG 25
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Filler, Flame Retardant
Chemical Family:
Aluminum Compounds
Labeling Claims:
SVHC Chemicals-free, High Purity, Halogen-free
Portaflame® SG 25 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
Portaflame® SG 10
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Filler, Flame Retardant
Chemical Family:
Aluminum Compounds
Labeling Claims:
SVHC Chemicals-free, Halogen-free
Portaflame® SG 10 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
Boratherm™ SG150 E
Chemical Name:
Alumina Trihydrate (ATH), Aluminum Oxide
Chemical Family:
Aluminum Compounds
Functions:
Flame Retardant
Features:
Excellent Smoke Resistance, Good Thermal Conductivity, High Thermal Conductivity, Low Viscosity, Flame Retardant
Boratherm™ SG150 E is produced from carefully selected synthetic aluminum hydroxide (ATH). Boratherm™ SG-E grades are used in various applications because of their high thermal conductivity, flame retardancy, smoke suppression, and low viscosity. Combining these grades with finer products (ATH or Al2O3-based) makes it possible to obtain a high packing density, resulting in excellent thermal conductivity. Boratherm™ SG is perfectly suited for formulations needing good flowability. It is specially designed to offer an ultra-low surface area and large particle sizes.
Dar-Tech Inc.
Portaflame® SG 20
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Filler, Flame Retardant
Chemical Family:
Aluminum Compounds
Labeling Claims:
SVHC Chemicals-free, High Purity, Halogen-free
Portaflame® SG 20 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
Portaflame® SG 35
Chemical Name:
Alumina Trihydrate (ATH)
Functions:
Filler, Flame Retardant
Chemical Family:
Aluminum Compounds
Labeling Claims:
SVHC Chemicals-free, High Purity, Halogen-free
Portaflame® SG 35 is produced from carefully selected synthetic aluminum hydroxide (ATH). The standardized quality of Portaflame® SG is guaranteed by means of an ISO 9001-certified quality management plan. The chemical composition of the raw material and the finished product is closely monitored, and the particle size is kept within a narrow variation.
Dar-Tech Inc.
Boratherm™ SG 200LVS
Chemical Name:
Alumina Trihydrate (ATH)
Chemical Family:
Aluminum Compounds
Functions:
Flame Retardant
Features:
Good Flow, Flame Retardant
Boratherm™ SG 200LVS is a blended product produced from carefully selected synthetic aluminum hydroxide (ATH). This product is used in applications where heat-dissipation and fire-retardancy are critical properties, e.g., in thermal interface materials (including electronic vehicle battery heat management), casting resins for power transformers, and potting and encapsulating materials in electric and electronic applications. The particle size distribution of the Boratherm™ SG 200LVS is already optimized, so blends with other finer or coarser aluminum-containing grades are no longer needed to obtain the optimum packing density, resulting in the right balance between flow and thermal conductivity.
Scott Bader
Crestabond® M1-04SL Structural Adhesive
Chemical Family:
Methacrylates
Product Type:
Structural Adhesive, Potting Compound, 2K (2 component) Adhesive, Adhesive, Encapsulant
Application Area:
Wind Mill Blades, Nacelles, Tractor, Truck, Harvesters, Doors, Buses, Car, Windows, Marine Applications, Diggers, Train, Electric Vehicle (EV) Batteries, Caravans, Housing
Compatible Substrates & Surfaces:
Stainless Steel, Aluminum, Polyesters, Carbon Fiber, Carbon Steel, Composites, Acrylonitrile Butadiene Styrene (ABS), Polyvinyl Chloride (PVC), Epoxies, Vinyl Esters, Acrylic, Polycarbonate (PC), Metal, Polyurethane
Crestabond® M1-04SL Structural Adhesive is a toughened, two-component 10:1 acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts.
Cosmic Plastics
Cosmic Epoxy E4920AC
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy EH21
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.
Cosmic Plastics
Farboset® 2460
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Resistor Network, Resistor, Coils, Encapsulant
Volume Resistivity:
18000000000000.0 - 18000000000000.0 Ohm-m
Flexural Strength:
1372.0 - 1372.0 MPa
Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.
Cosmic Plastics
Cosmic Epoxy E4920AT
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920AT is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and comes in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy E4920CD
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy E4930R
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Transistor, Resistor, Optocoupler, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.
Cosmic Plastics
Farboset® 2270
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Encapsulant
Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.
Cosmic Plastics
Cosmic Epoxy E4920
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920 is a mineral-filled epoxy molding compound available either in granular form or preformed in various sizes and weights. It features excellent moisture resistance, thermal cycling stability, and remarkable moldability. Furthermore, parts molded from this material do not support fungus growth, and it is specifically designed for the encapsulation of passive devices, including capacitors, inductors, diodes, and rectifiers.
Cosmic Plastics
Farboset® 2510
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.
Cosmic Plastics
Cosmic Epoxy EH40
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.
Cosmic Plastics
DAP D72/6120F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
Cosmic Plastics
Cosmic Epoxy EH31
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.
Cosmic Plastics
DAP D33/6120
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1720.0 - 1720.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.
Cosmic Plastics
Cosmic Epoxy EH81
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
DAP D44/6160
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1740.0 - 1740.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.
Cosmic Plastics
Cosmic Epoxy E4940P
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940P is a mineral-filled, glass-reinforced epoxy molding compound supplied in granular form. It is specifically designed for high-volume encapsulation applications, particularly for resistor networks and fiber-optic connectors. This compound offers high quality, reliability, and good moldability for such applications.
Cosmic Plastics
Farboset® 2500
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2500 is a mineral-filled, flame-retardant, novolac epoxy molding compound that offers fast cure rates at low temperatures, laser markability, and good moldability. This compound is formulated for encapsulating surface mount ceramic and tantalum capacitors, along with other applications that require quick cycle times. Its flame-retardant properties make it suitable for applications where fire safety is a concern, while its rapid curing and ability to be laser marked enhance its utility in modern production processes.
Cosmic Plastics
Farboset® 2220
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Bushings, Encapsulant, Insulators
Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.
Cosmic Plastics
Cosmic Epoxy E4920FC
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
55000000000000.0 - 55000000000000.0 Ohm-m
Flexural Strength:
127.465 - 127.465 MPa
Cosmic Epoxy E4920FC is a mineral-filled epoxy molding compound available either in granular form or preformed in a variety of sizes and weights. It offers excellent moisture resistance, thermal cycling stability, and outstanding moldability. Parts molded from this material also resist fungus growth and are designed for the encapsulation of passive devices such as capacitors, inductors, diodes, and rectifiers.
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