- Product Type:Potting Compound, 1K (1 component) Adhesive, Encapsulant
- Compatible Substrates & Surfaces:Gold, Copper, Metal
- Chemical Family:Epoxy & Epoxy Derivatives
Bondline 7784 is a medium viscosity, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, heat sink attach, lid sealing and component staking adhesive. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver, and copper.