- Polymer Name:Thermoset Polyimide (PI)
- Functions:Prepreg
- Processing Methods:Out of Autoclave Prepreg
Toray TC890 high temperature polyimide prepreg system utilizes PROOF Research Advanced Composites Division 900HT resin system. TC890 is a high temperature, polyimide-based thermoset prepreg with outstanding dry property retention at 343°C (650°F), wet service property retention at 288°C (550°F), and short-term and intermittent service temperature capability to 427°C (800°F). TC890 has been successfully demonstrated in short term, transient heating Applicationss to temperatures as high as 1300°F. TC890 is an excellent non-MDA replacement for high temperature PMR-15 Applicationss. TC890 prepreg system is easily processable and thermally stable, exhibiting the highest glass transition temperature of commercially available structural matrices. This system displays exceptional toughness, excellent dielectric properties, and low toxicity. High Temperature Polyimide