Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Stress Free
- One or Two Component
- Hyper-Conductive
- Epoxy Paste Adhesive
Applications & Uses
- Markets
- Application Area
- Applications
- Large area Die
- Substrate/Component
- Reworkability
- Mismatched CTE's
- Solder Replacement
- Application Process
- Mix adhesive in 1:1weight ratio.
- Dispense adhesive onto clean substrate.
- Cure according to one of the recommended cure schedules.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Average Viscosity (0.5 rpm, 25°C) | 156000 - 234000 | cp | Brookfield DV-1, Spindle CP51 |
| Cured Density | 3.6 - 4.4 | gm/cc | — |
| Current Carrying Capabilities | 35.0 | Amp/mm² | — |
| Device Push-off Strength | 17.2 | N/mm² | — |
| Electrical Resistivity (150°C/60 min) | max. 9x10⁻⁵ | ohm-cm | — |
| Glass Transition Temperature | -22 to -18 | °C | — |
| Lap-Shear Strength | min. 5.2 | N/mm² | — |
| Linear Thermal Expansion Coefficient | 102 - 138 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 130 | °C | — |
| Thermal Conductivity | 7.11 - 8.69 | W/m-°C | — |
Regulatory & Compliance
- Quality Standards
Technical Details & Test Data
- Cure Schedules
Temperature Time 25°C 120 hr 80°C 8hr 100°C 4 hr 125°C 2 hr 150°C 1 hr Note:
- If material is premixed and frozen, thaw for 30 minutes and cure according to one of the recommended schedules.
Packaging & Availability
- Availability
EG8050-HC is available in syringes for automatic needle dispense applications or in jar. Both viscosity and thixotropic index can be modified to ones specific needs. EG8050-HC can be premixed and frozen.
Storage & Handling
- Shelf Life
- 1 year (25°C)
- Storage Conditions
- Storage Temperature: 25°C
- Shelf Life: 1 year
Note:
- Shelf life is for unmixed components. If premixed: 40°C for 6 months. After mixing, pot life is 4 hours at 25°C.