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AI Technology LESP 7670-HF

Product Type: Conductive Adhesive

Application Area: Lid Seal

Cure Method: Chemical Cure

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Applications & Uses

    Application Area
    Cure Method

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Electrical Resistivitymin. 5X10¹⁴Ω-cm
    Viscosity (at 5 rpm, Thixotropic Index=>4)65000cPs
    Glass Transition Temperature130°C
    Device Push Off Strengthmin. 3000psi
    Hardnessapprox. 90Shore D
    Cured Density (for Conductive Adhesive Portion)1.6g/cc
    Thermal Conductivitymin. 0.20W/m-°K
    Coefficient of Thermal Expansion (X-Y=Z, Isotropic)35ppm/°C
    Maximum Continuous Operation Temperature150°C
    Decomposition Temperature (at 5% Weight Loss)min. 450°C
    Recommended Curing Temperature (for 30minutes)min. 150°C

    Regulatory & Compliance

    Certifications & Compliance