Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Application Area
- Cure Method
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Electrical Resistivity | min. 5X10¹⁴ | Ω-cm | — |
Viscosity (at 5 rpm, Thixotropic Index=>4) | 65000 | cPs | — |
Glass Transition Temperature | 130 | °C | — |
Device Push Off Strength | min. 3000 | psi | — |
Hardness | approx. 90 | Shore D | — |
Cured Density (for Conductive Adhesive Portion) | 1.6 | g/cc | — |
Thermal Conductivity | min. 0.20 | W/m-°K | — |
Coefficient of Thermal Expansion (X-Y=Z, Isotropic) | 35 | ppm/°C | — |
Maximum Continuous Operation Temperature | 150 | °C | — |
Decomposition Temperature (at 5% Weight Loss) | min. 450 | °C | — |
Recommended Curing Temperature (for 30minutes) | min. 150 | °C | — |
Regulatory & Compliance
- Certifications & Compliance