Products

EG7658 is a reworkable, aluminum nitride filled, electrically insulating and thermally conductive epoxy paste adhesive. It which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (ie., alumina to aluminum, silicon to copper). The high thermal conductivity and flexibility make it excellent for bonding high-powered, large area die and components. EG7658 can be reworked using temperatures higher than the cure temperature from 80-150°C to soften the bond line. Use a tool adequate to break the bond and remove. Clean any residue with a solvent which will not damage the parts.

SR8850-2 is a pure silver-plated copper filled conductive RTV silicone sealant. This one-component electrically conductive silicone adhesive cures at room temperature when exposed to atmospheric moisture.The material has no corrosive by-products and has good adhesion properties to metals, plastics, silicones, ceramics and glass. SR8850-2 is provided as a one-part electrically conductive elastomer silicone adhesive sealant with a compatible primer. The adhesive has a continuous operating temperature of 125°C while conductivity is maintained when exposed to temperatures up to 200°C. The silicone cures when exposed to atmospheric conditions. The typical curing schedule is 48 hours at 25°Cand 60% relative humidity.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

EG7655 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80-100°C for easier rework. The cured adhesive is flexible with Type A hardness of 80 and tensile elongation of more than 30%.

ME7857-SC is a medium viscosity, silicon carbide filled, flexible epoxy for snap curing application. It is a reworkable, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility down to -60°C. Ideal for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The stress-free flexible adhesive maintains good stable bond strength of 100 psi from 150-250°C and has outstanding thermal stability.

TP7205 is an alumina filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. TP7205 has good thermal conductivity and is tacky at room temperature. The adhesive film typically can be used for most applications at temperature from -65 to 150°C. Customers must test the adhesive for their specific application to confirm its suitability.

EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.

TP8205 is a silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.

TP7209 is a low bond strength thermoplastic film adhesive. It is designed for bonding heat-sink, component, and substrate. This unique diamond flled material has excellent thermal conductivity and is tacky at room temperature.