Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Low CTE.
- Low moisture absorption.
- Low ionic impurities.
- High electrical conductivity.
- High thermal conductivity.
- Chip or component adhesive.
- High temperature devices.
- High power devices.
Applications & Uses
- Applications
- Application Area
- Application Method
- Cure Method
- Application Procedures
- Thaw to room temperature before opening container.
- Dispense adhesive onto clean die or substrate.
- Cure according to the recommended schedules.
- Note
The monomer contained in this product is subject to crystallization even at room temperature. If product is thawed and remains crystallized, simply place in 40°C environment for as long as needed to return product to the liquid state i.e. usually not more that 15-20 minutes.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 150°C, 60minutes) | max. 5x10⁻² | Ω-cm | — |
| Glass Transition Temperature | 216 - 264 | °C | — |
| Glass Transition Temperature | 240 | °C | — |
| Glass Transition Temperature | 220 | °C | — |
| Lap Shear Strength | min. 6.9 | N/mm² | — |
| Device Push Off Strength | min. 3000 | psi | — |
| Device Push Off Strength | min. 17.2 | N/mm² | — |
| Hardness | 72 - 88 | Shore D | — |
| Hardness | approx. 99 | Shore D | — |
| Cured Density | 3.15 - 3.85 | g/cc | — |
| Thermal Conductivity | min. 9 | W/m-°C | — |
| Thermal Conductivity | min. 8 | W/m-°K | — |
| Coefficeint of Linear Thermal Expansion | 19.55 - 26.45 | ppm/°C | — |
| Maximum Continuous Operation Temperature | min. 250 | °C | — |
| Maximum Continuous Operation Temperature | max. 300 | °C | — |
| Average Viscosity (at 25°C, 5rpm, Spindle CP51) | 52000 - 78000 | cPs | Brookfield Viscometer DV-1 |
| Electrical Resistivity | max. 5x10⁻² | Ω-cm | — |
| Electrical Resistivity | max. 0.003 | Ω-cm | — |
| Die Shear Strength | min. 2500 | psi | — |
| Viscosity (at 5 rpm) | 65000 | cPs | — |
| Viscosity (at 5 rpm, Thixotropic Index=>4) | 10000 | cPs | — |
| Cured Density (for Conductive Adhesive Portion) | 4 | g/cc | — |
| Coefficient of Linear Thermal Expansion (Tab-Composite, X-Y=Z, Isotropic) | 26 | ppm/°C | — |
| Decomposition Temperature (at 5% Weight Loss) | min. 500 | °C | — |
| Recommended Curing Temperature (for 10minutes) | min. 150 | °C | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 125°C 2 hrs 150°C 45 mins 175°C 10 mins Pot life is 5 days at 25°C.
Packaging & Availability
- Product Availability
MC8880 is available in syringes for automatic dispense application.
Storage & Handling
- Shelf Life
- 1 Year
- Storage Information
Storage temperature: -40 °C.