Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Applications
- Application Area
- Cure Method
- Applications
- Automotive Electronics
- Bonding & Sealing
- Electrics & Electronics
- Electronic Control Unit (ECU)
- Power Control Unit (PCU)
- Power Electronics
- FIPG applications
- Application Details
Processing
- Surface preparation
- All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 986/1K. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.
- All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 986/1K. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds. If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.
- Dispensing
- Because of the thixotropy (shear thinning effect) SEMICOSIL® 986/1K can be dispensed easily with all dispensing equipments. Since silicones dissolve notable amounts of air, an in-line degassing is recommended.
- Because of the thixotropy (shear thinning effect) SEMICOSIL® 986/1K can be dispensed easily with all dispensing equipments. Since silicones dissolve notable amounts of air, an in-line degassing is recommended.
- Curing
- SEMICOSIL® 986/1K works best when cured at 115 °C or more depending on the size and heat sink properties of the components.
- Temperature Curing time, thickness 10 mm
- 100°C - 6 h
- 130°C - 30 min
- 150 °C - 10 min
- Adhesion
- SEMICOSIL® 986/1K shows good primerless adhesion to many substrates. We recommend running preliminary tests to optimize conditions for the particular application.
- Surface preparation
Properties
- Cured Properties
- Uncured Properties
- Properties
- Ready-to-use, one-part system
- Thixotropic
- Translucent
- Medium hardness
- High flexibility (low-stress-adhesive)
- Primerless adhesion to many substrates
- Rapid heat cure
- Ultraviolett fluorescing
- Note
Cured for 30 min at 150 °C in a circulating air oven.
| Value | Units | Test Method / Conditions | |
| Density (at 23°C) | 1.07 | g/cm³ | DIN EN ISO 1183-1 A |
| Elongation (at break) | 200 | % | DIN 53504 S2 |
| Modulus (at 100 % elongation) | 3 | N/mm² | ISO 37 |
| Shore Hardness A | 51 | — | ISO 868 |
| Tear Strength | 8 | N/mm | ASTM D 624 B |
| Tensile Strength | 5 | N/mm² | DIN 53504 S2 |
| Value | Units | Test Method / Conditions | |
| Density (at 23°C) | 1.07 | g/cm³ | DIN EN ISO 2811-1 |
| Dynamic Viscosity (at 25°C, Shear rate 0.5 s⁻¹) | 300000 | mPa·s | ISO 3219 |
| Dynamic Viscosity (at 25°C, Shear rate 25 s⁻¹) | 35000 | mPa·s | ISO 3219 |
Regulatory & Compliance
- Certifications & Compliance
- Chemical Inventories
- Quality Standards
Packaging & Availability
- Country Availability
- Regional Availability
Storage & Handling
- Storage Information
SEMICOSIL® 986/1K should be stored between +5 and +25°C in its tightly closed containers.