Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Applications
- Application Area
- Cure Method
- Applications
- Automotive Electronics
- Bonding & Sealing
- Electrics & Electronics
- Power Electronics
- General purpose adhesive for the electronics industry
- FIPG applications
- Application Details
Processing
- Surface preparation
- All surfaces must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 989/1K. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds.
- If a substrate’s ability to inhibit cure is unknown, a small scale test should be run to determine compatibility.
- Dispensing
- Because of the thixotropy (shear thinning effect) SEMICOSIL® 989/1K can be dispensed easily with all dispensing equipments.
- To eliminate any air introduced during dispensing or trapped under components or devices a vacuum encapsulation is recommended.
- SEMICOSIL® 989/1K shows good primerless adhesion to many substrates. We recommend running preliminary tests to optimize conditions for the particular application.
- Curing
- SEMICOSIL® 989/1K works best when cured at 115 °C or more depending on the size and heat sink properties of the components.
- SEMICOSIL® 989/1K works best when cured at 115 °C or more depending on the size and heat sink properties of the components.
-
Temperature Curing time,
thickness 1 cm100°C 6h 130°C 1h 150°C 10 min
- Surface preparation
Properties
- Typical Properties
- Cured Properties
- Uncured Properties
- Properties
- One-part, ready-to-use
- Thixotropic
- Transparent
- Medium hardness
- High flexbility
- Rapid heat curing
- Primerless adhesion to many substrates
- Note
Cured for 30 min at 150 °C in a circulating air oven
| Value | Units | Test Method / Conditions | |
| Density (at 23°C) | approx. 1.1 | g/cm³ | DIN 53479 |
| Dynamic Viscosity (at 25°C, Shear rate 0.5 s⁻¹) | 300000 | mPa·s | DIN EN ISO 3219 |
| Dynamic Viscosity (at 25°C, Shear rate 25 s⁻¹) | 30000 | mPa·s | DIN EN ISO 3219 |
| Value | Units | Test Method / Conditions | |
| Density (at 23°C) | approx. 1.07 | g/cm³ | DIN EN ISO 1183-1 A |
| Elongation (at break) | 200 | % | DIN 53504 S2 |
| Shore Hardness A | 55 | — | ISO 868 |
| Tensile Strength | 5 | N/mm² | DIN 53504 S2 |
| Value | Units | Test Method / Conditions | |
| Density | approx. 1.07 | g/cm³ | DIN EN ISO 1183-1 |
| Dynamic Viscosity (at 25°C, Shear rate 0.5 s⁻¹) | 300000 | mPa·s | DIN EN ISO 3219 |
| Dynamic Viscosity (at 25°C, Shear rate 25 s⁻¹) | 300000 | mPa·s | DIN EN ISO 3219 |
Regulatory & Compliance
- Certifications & Compliance
Packaging & Availability
- Country Availability
- Regional Availability