Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Cure Method
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Electrical Resistivity | max. 0.0003 | Ω-cm | — |
Viscosity (at 5 rpm, Thixotropic Index=>4) | 20000 | cPs | — |
Glass Transition Temperature | -20 | °C | — |
Device Push Off Strength | min. 2000 | psi | — |
Hardness | approx. 80 | Shore A | — |
Cured Density (for Conductive Adhesive Portion) | 4.8 | g/cc | — |
Thermal Conductivity | min. 12 | W/m-°K | — |
Coefficient of Linear Thermal Expansion (Tab-Composite, X-Y=Z, Isotropic) | 90 | ppm/°C | — |
Maximum Continuous Operation Temperature | min. 180 | °C | — |
Decomposition Temperature (at 5% Weight Loss) | min. 450 | °C | — |
Recommended Curing Temperature (for 10minutes) | min. 175 | °C | — |
Regulatory & Compliance
- Certifications & Compliance