Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Stress free.
- High thermal conductivity.
- Reworkable.
- Epoxy film adhesive.
- Large area die attach.
- Substrate and component.
- Reworkability.
- Mismatched CTE's.
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Let adhesive thaw in bag or package, as received, at ambient for 15 minutes.
- Cut to desired size. Clean contact surfaces if needed.
- Remove one side of the release liner by peeling up a corner of the release liner. Fold the release liner over, approaching a 180° angle.
- Pull the release liner quickly, removing it with one stroke. Apply to substrate, then remove other side of release liner and attach die or component.
- Cure using one of the recommended cure schedules.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 150°C, 60minutes) | min. 1x10¹⁴ | Ω-cm | — |
| Dielectric Strength | 740 - 760 | Volts/mil | — |
| Glass Transition Temperature | -20 | °C | — |
| Glass Transition Temperature | - 27.5 to -22.5 | °C | — |
| Lap Shear Strength | 6.21 - 7.59 | N/mm² | — |
| Device Push Off Strength | 14.94 - 18.26 | N/mm² | — |
| Hardness | 73.8 - 90.2 | Shore A | — |
| Cured Density | 2.07 - 2.53 | g/cc | — |
| Thermal Conductivity | min. 3.6 | W/m-°C | — |
| Thermal Conductivity | 3.24 - 3.96 | W/m-°C | — |
| Coefficeint of Linear Thermal Expansion | 93.5 - 126.5 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Pot Life (at 25°C) | approx. 72 | hours | — |
| Electrical Resistivity | min. 1x10¹⁴ | Ω-cm | — |
| Die Shear Strength | min. 1500 | psi | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time Pressure 80°C 8 hrs 3-5 psi 100°C 4 hrs 3-5 psi 125°C 2 hrs 3-5 psi 150°C 1 hr 3-5 psi - The die or component can also be tacked on the substrate at 80°C or higher with 5 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.
- Pot life is 72 hrs at 25°C.
Packaging & Availability
- Product Availability
TK7758 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.
Storage & Handling
- Shelf Life
- 1 Year (at -40°C)
- Storage Information
Storage temperature: -40°C in sealed package.