Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
Applications & Uses
- Markets
- Compatible Substrates & Surfaces
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Conformable Adhesive Thickness (for Bumps Absorption) | 20, 100, 200, 400 | μm | — |
Adhesive Stretchability (Strain Before Breaking) | min. 30 | % | — |
Adhesive Glass Transition Temperature | 240 | °C | — |
Release Liners (Top/Bottom) | 50/50 | μm | — |
Supported Carrier | Glass | — | — |
Melt Bonding Temperature | 140 - 160 | °C | — |
Melt Bonding Pressure | 10 - 15 | psi | — |
Shear Bond Strength (at 25°C to 50°C, as Laminated) | 800 - 1200 | psi | — |
Shear Bond Strength (at 25°C) | 5500 | psi | — |
Shear Bond Strength (at 100°C) | 2500 | psi | — |
Shear Bond Strength (at 150°C) | 200 | psi | — |
High Temperature Processing Stability (at 250°C, Oxygen Free Condition) | No limitation | — | — |
High Temperature Processing Stability (at 300°C, Oxygen Free Condition) | No limitation | — | — |
High Temperature Processing Stability (at 350°C, Oxygen Free Condition) | min. 60 | minutes | — |
Regulatory & Compliance
- Certifications & Compliance
- Quality Standards