Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Application Area
- Compatible Substrates & Surfaces
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Melt Bonding Temperature | 140 - 160 | °C | — |
| Shear Bond Strength (at 25°C) | min. 300 | psi | — |
| Shear Bond Strength (at 50°C) | min. 300 | psi | — |
| Shear Bond Strength (at 75°C) | min. 150 | psi | — |
| Shear Bond Strength (at 100°C) | min. 75 | psi | — |
| Suggested Zero Shear Removal Temperature | Ambient peel release only (0% residual) | °C | — |
| Cleaning Solvent (Process for Wafer) | No cleaning | — | — |
| Cleaning Solvent (Process for Carrier) | No cleaning | — | — |
Regulatory & Compliance
- Certifications & Compliance