Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- In situ "Curing"
- Pressure Sensitive
- Electrically Insulating
- Film Adhesive
Applications & Uses
- Application Area
- Applications
- Component Attach
- Heat Sink Attach
- Substrate Attach
- Application Process
- Cut to desired size.
- Remove one side of releasel liner from adhesive.
- Place on substrate or component with rolling finger pressure, then remove the other release liner.
- Place component on substrate with insertion pressure of 10 psi or more. More bond strength will develop in-situ over time during operation.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Cured Density | 1.98 - 2.42 | gm/cc | — |
| Device Push-off Strength | min. 4.1 | N/mm² | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Electrical Resistivity (25°C) | min. 1x10¹⁴ | ohm-cm | — |
| Glass Transition Temperature | -27.5 to -22.5 | °C | — |
| Hardness (Type) | max. 40 | Shore A | — |
| Lap-Shear Strength | 1.4 | N/mm² | — |
| Linear Thermal Expansion Coefficient | 93.5 - 126.5 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Thermal Conductivity | 3.24 - 3.96 | W/m-°C | — |
Technical Details & Test Data
- Temperature/Bond Force
Temperature Time
Bond Force25°C 650 psi 50°C 550 psi 75°C 380 psi 100°C 300 psi 125°C 250 psi
Packaging & Availability
- Availability
CB7208-EDA2 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.006" and 0.010". Special thicknesses are available.
Storage & Handling
- Shelf Life
- 1 year (0 - 5°C)