- Applications:Appliances & Electronics, Equipment & Parts, Semiconductor Manufacturing
- Product Families:Other Adhesives & Sealants, Adhesives & Sealants
- Chemical Family:Epoxy & Epoxy Derivatives
EG7635 is a alumina filled, electrically insulating and thermally conductive rigid epoxy paste adhesive. While bonding at ambient temperature can be achieved overnight, elevated temperatures will accelerate curing, exponentially. EG7635 high thermal conductivity and high strength makes it excellent for bonding substrates, components and heat sinks where thermal management is critical. It has more than 15 years of proven records of providing bonding to difficult substrates. EG7635 exibits reduced bond strength at 80-100°C for easier rework.