Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Tacky, Non Curing.
- Pressure Sensitive.
- High Thermally Conductive.
- Electrically Insulating.
- Film Adhesive.
- Component Attach.
- Heat Sink Attach.
- Substrate Attach.
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Cut or pre-cut to desired size.
- Remove one side of release paper from adhesive.
- Place on substrate or component with rolling finger pressure, then remove the other release paper.
- Place component on substrate with insertion pressure of 15 psi or more.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 25°C, 1minute) | min. 1x10¹⁴ | Ω-cm | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Glass Transition Temperature | -60.5 to -49.5 | °C | — |
| Lap Shear Strength | min. 0.69 | N/mm² | — |
| Device Push Off Strength | 1.26 - 1.54 | N/mm² | — |
| Hardness | 36 - 44 | Shore A | — |
| Cured Density | 1.98 - 2.42 | g/cc | — |
| Thermal Conductivity | 10.26 - 12.54 | W/m-°C | — |
| Coefficeint of Linear Thermal Expansion | 93.5 - 126.5 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
Regulatory & Compliance
- Certifications & Compliance
- Quality Standards
Packaging & Availability
- Product Availability
- TP7209 is a low bond strength thermoplastic film adhesive. It isdesigned for bonding heat-sink, component, and substrate.
- This unique diamond filled material has excellent thermal conductivity and is tacky at room temperature.
Storage & Handling
- Shelf Life
- 1 Year (at 25°C)