Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Ambient curable.
- Thermally conductive.
- 2-component epoxy paste.
- High bond strength.
- Heat-sink attach.
- Substrate attach.
- Component attach.
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Store Part A and Part B at ambient.
- Mix A and B 1:1 by weight.
- Cure according to one of the recommended schedules.
- Applications
- Heat-Sink Attach
- Substrate Attach
- Component Attach
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 150°C, 30minutes) | min. 1x10¹⁴ | Ω-cm | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Glass Transition Temperature | 54 - 66 | °C | — |
| Lap Shear Strength | min. 6.9 | N/mm² | — |
| Device Push Off Strength | min. 17.2 | N/mm² | — |
| Cured Density | 2.07 - 2.53 | g/cc | — |
| Thermal Conductivity | 1.53 - 1.87 | W/m-°C | — |
| Coefficeint of Linear Thermal Expansion | 45 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Average Viscosity (at 25°C, 0.5rpm, Spindle CP51) | 228000 - 342000 | cPs | Brookfield Viscometer DV-1 |
| Thixotropic Index | 6 | — | — |
Regulatory & Compliance
- Certifications & Compliance
- Quality Standards
Technical Details & Test Data
- Cure Schedules
Temperature Time 25°C 24 hrs 80°C 120 mins 100°C 60 mins 125°C 30 mins 150°C 15 mins - Note
Mixed components gel, an additional 80°C at 120 min. is suggested for complete cure.
Packaging & Availability
- Product Availability
EG7635 is available in syringes for automatic needle dispense applications or in jars. Upon request, the material can be shipped premixed and frozen.
Storage & Handling
- Shelf Life
- 1 Year (at 25°C)