company tower banner
AI Technology Company Logo

AI Technology TP 8205

TP8205 is a silver filled, low bond strength thermoplastic film adhesive. It is designed for bonding heat sink, component, and substrate. It is electrically and thermally conductive.

Product Type: Pressure Sensitive Adhesive, Thermal Adhesive

Application Area: Die/Chip Attach, Heat Sink

Features: Electrically Conductive, Good Bonding Strength, Tacky, Thermally Conductive

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Product Features
  • Tacky.
  • Pressure sensitive.
  • Electrically conductive.
  • Non curing.
  • Film adhesive.
  • Component attach.
  • Heat sink attach.
  • Substrate attach.

Applications & Uses

Application Procedures
  • Cut or pre-cut to desired size.
  • Remove one side of release paper from adhesive.
  • Place on substrate or component with roling finger pressure, then remove the other release paper.
  • Place component on substrate with insertion pressure of 15 psi or more.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 25°C, 1minute)max. 5x10⁻²Ω-cm
Glass Transition Temperature-27.5 to -22.5°C
Lap Shear Strengthmin. 0.69N/mm²
Device Push Off Strength1.26 - 1.54N/mm²
Hardness36 - 44Shore A
Cured Density2.7 - 3.3g/cc
Thermal Conductivity5.13 - 6.27W/m-°C
Coefficeint of Linear Thermal Expansion93.5 - 126.5ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C

Regulatory & Compliance

Certifications & Compliance

Packaging & Availability

Product Availability

TP8205 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.004" and 0.006". Special thicknesses are available. TP8205 can be obtained in liquid form (LTP8205). This product is fiberglass reinforced.

Storage & Handling

Shelf Life
1 Year (at 25°C)