Products

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

ME8452-A is an accelerated version of ME8452 for snap-curing applications.This novel silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

ME7665-DA is a rapid curing dielectric die-attach thermal adhesive. It contains alumina crystallite of less than 3 micron in particle size. It is a fast curing insulating epoxy adhesive for snap-curing applications. This thixotropic (TI is approx. 4.0) paste is solvent free. It is designed for automated, online bonding processing. ME7665-DA-LV is thermally conductive with less than 20 ppm ionic impurities. It can be dispensed with traditionally pressure-time or more accurately with positive volumetric dispenser. It has medium viscosity and high thixotropic index.

EG7655 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive which exhibits outstanding flexibility for bonding materials with highly mismatched CTE'S (i.e., alumina to aluminum, silicon to copper). EG7655's high thermal conductivity and flexibility make it excellent for bonding large area substrates, components and heat sinks where thermal management is critical. EG7655 exhibits reduced bond strength at 80-100°C for easier rework. The cured adhesive is flexible with Type A hardness of 80 and tensile elongation of more than 30%.

ME8412 is a silver filled, solvent free, electrically and thermally conductive paste. It is designed for automated, online, die attach processing. It is thixotropic and will not sag on vertical surfaces. Designed to meet the hybrid adhesive specification, Mil Std 883; Method 5011.4 in terms of ionic impurities, ME8412 exhibits low outgassing at 125C and passes NASA outgassing requirements.

RTK7659 is a tack-film, reworkable, diamond-filled, epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This B-Staged, dielectric adhesive offers excellent reworkability at 80-150°C. RTK7659 has excellent thermal conductivity and the low Tg of the adhesiveimposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ESP8450-WL is a high melt-flow version of standard ESP8450 designed for large area bonding and wafer-level lamination for stack-chip applications. It is a solvent resistant, silver-filled, flexible epoxy film adhesive designed for bonding die, component and substrate to a mismatched substrate or carrier. This novel, B-staged electrically conductive adhesive offers excellent flexibility from-55°C to 150°C. The dry, tack-free handling of the film makes it ideal for an automated pick and place assembly and is reworkable from 80°C to 150°C. ESP8450-WL has excellent thermal conductivity and its low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

ME8630-RC is an extra fine silver filled 100% solid rapid curing die- attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-RC has been designed to eliminate bleeding on both silver plated copper and alloy 42 lead frames. It maintains more than 150 psi bond strength at 250°C for high temperature wire-bonding.

Tack-Free ESP 7455 is an alumina-filled, epoxy film adhesive designed for bonding component and substrate to a mismatched substrate or carrier. The dry, tack-free handling of the film makes it suitable for an automated assembly. The adhesive film has very low ionic impurities of less than 10 ppm and high thermal stability with TGA degradation at 450°C. ESP7455 has good thermal conductivity. The extra low Tg of -60°C helps to minimize thermal stress on the bonded parts during thermal cycling or shock testing from -55 to 150°C.

ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.