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AI Technology ME 8630-RC

ME8630-RC is an extra fine silver filled 100% solid rapid curing die- attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-RC has been designed to eliminate bleeding on both silver plated copper and alloy 42 lead frames. It maintains more than 150 psi bond strength at 250°C for high temperature wire-bonding.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Application Method: Injection

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Product Features
  • 100% solid.
  • Low temperature curable.
  • Fine pitch with extra fine silver.
  • Long pot life.
  • In line die attach.
  • Large and small dies.
  • Rapid curing for smaller dies (<10mm).
  • Low temperature curing for large dies.

Applications & Uses

Application Area
Application Method
Cure Method
Application Procedures
  • Thaw to ambient temperature for 30 minutes before opening jar or using syringes.
  • Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
  • Cure according to one of the recommended cure schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)max. 5x10⁻⁴Ω-cm
Glass Transition Temperature80°C
Glass Transition Temperature72 - 88°C
Current Carrying Capabilitiesmin. 20Amp/mm²
Device Push Off Strengthmin. 16.6N/mm²
Hardness72 - 88Shore D
Cured Density3.15 - 3.85g/cc
Thermal Conductivitymin. 8.6W/m-°C
Thermal Conductivity7.74 - 9.46W/m-°C
Coefficeint of Linear Thermal Expansion34 - 46ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Pot Life (at 25°C)7Days
Viscosity (at 24°C, 5rpm, Spindle CP51, Thixotropic Index=3-5)12000 - 18000cPsBrookfield Viscometer DV-1
Electrical Resistivitymax. 5x10⁻⁴Ω-cm
Die Shear Strengthmin. 2400psi
Viscosity (at 5 rpm, Thixotropic Index=>4)15000cPs

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time
125°C 30 mins
150°C 15 mins
175°C 8 mins

Packaging & Availability

Product Availability

ME8630-RC is available in syringes for automatic needle dispense applications or in jars.

Storage & Handling

Shelf Life
1 Year (at -40°C)
Storage Information

Storage temperature: -40°C.