Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Tacky-free epoxy film.
- Electrical conductive adhesive.
- Moisture-temperature resistant.
- -60 tg: flexible stress-free.
- Large area die attach.
- Mismatched CTE substrate attach.
- Electrical & thermal ground plane bonding.
- Wafer lamination and stack-chip bonding.
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Let product stay at room temperature for 15 minutes. Remove film from protective paper.
- Cut to desired size.
- Place on substrate and cure according to one of the recommended schedules.
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Electrical Resistivity (at 150°C, 60minutes) | max. 4x10⁻⁴ | Ω-cm | - |
Glass Transition Temperature | -60 | °C | - |
Glass Transition Temperature | -45 | °C | - |
Device Push Off Strength | min. 10.3 | N/mm² | - |
Hardness | 82 | Shore A | - |
Cured Density | 3.5 | g/cc | - |
Thermal Conductivity | min. 6.0 | W/m-°C | - |
Thermal Conductivity | 6.4 | W/m-°C | - |
Coefficeint of Linear Thermal Expansion | 110 | ppm/°C | - |
Maximum Continuous Operation Temperature | 150 | °C | - |
Electrical Resistivity | max. 4x10⁻⁴ | Ω-cm | - |
Die Shear Strength | min. 1500 | psi | - |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time Pressure 125°C 2 hrs 8-10 psi 150°C 1 hr 8-10 psi The die or component can also be tacked on the substrate at 100°C or higher with nominal placement pressure. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.
Packaging & Availability
- Product Availability
ESP8450-WL is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.
Storage & Handling
- Shelf Life
- 1 Year (at 0-5°C)
- Storage Information
Storage temperature: 0- 5°C in sealed package.