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AI Technology ME 8650-DA

MEB650-DA is a low viscosity silver filled flexible epoxy paste. This low ionic silver-filled paste is reworkable, solvent free, and electrically and thermally conductive. It is ideal for automatic dispensing in die- attach application with fine definition. Absolutely solvent-free and diluent free composition with low ionic impurities for high reliability. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). This stress free adhesive shows consistent medium bond strength up to 250°C at 200 psi.

Product Type: Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive, Thermal Adhesive

Application Area: Die/Chip Attach

Chemical Family: Epoxy & Epoxy Derivatives

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Product Features
    • Low viscosity.
    • 100% solid, thixotropic.
    • Flexible silver epoxy.
    • Die attach adhesive.
    • Low lonic impurities.
    • Large area die attach.
    • Microwave component and substrate attaches.
    • Module and substrate attaches.

    Applications & Uses

    Application Area
    Application Procedures
    • Thaw for 30 minutes before opening jar.
    • Dispense adhesive onto clean substrate.
    • Cure according to one of the recommended schedules.

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Electrical Resistivitymax. 4x10⁻⁴Ω-cm
    Thermal Conductivitymin. 3.6W/m-°C
    Thermal Conductivity3.24 - 3.96W/m-°C
    Die Shear Strengthmin. 1900psi
    Glass Transition Temperature-40°C
    Glass Transition Temperature-44 to -36°C
    Viscosity (at 5 rpm, Thixotropic Index=>4)8000cPs
    Electrical Resistivity (at 150°C, 30minutes)max. 4x10⁻⁴Ω-cm
    Current Carrying Capabilitiesmin. 20Amp/mm²
    Lap Shear Strengthmin. 8.3N/mm²
    Device Push Off Strengthmin. 13N/mm²
    Hardness72 - 88Shore A
    Cured Density3.15 - 3.85g/cc
    Coefficeint of Linear Thermal Expansion85 - 115ppm/°C
    Maximum Continuous Operation Temperaturemax. 150°C
    Pot Life (at 25°C)30Days
    Average Viscosity (at 24°C, 5rpm, Spindle CP51)6400 - 9600cPsBrookfield Viscometer DV-1
    Thixotropic Index6

    Regulatory & Compliance

    Certifications & Compliance

    Technical Details & Test Data

    Cure Schedules
    Temperature Time
    125°C 30 mins
    150°C 15 mins
    175°C 8 mins

    Packaging & Availability

    Product Availability

    ME8650-DA is available in syringes for automatic needle dispense applications or in jars.

    Storage & Handling

    Shelf Life
    1 Year (at -40°C), 1 Month (at 25°C)
    Storage Information

    Storage temperature: -40°C, 25°C.