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AI Technology ME 7665-DA

ME7665-DA is a rapid curing dielectric die-attach thermal adhesive. It contains alumina crystallite of less than 3 micron in particle size. It is a fast curing insulating epoxy adhesive for snap-curing applications. This thixotropic (TI is approx. 4.0) paste is solvent free. It is designed for automated, online bonding processing. ME7665-DA-LV is thermally conductive with less than 20 ppm ionic impurities. It can be dispensed with traditionally pressure-time or more accurately with positive volumetric dispenser. It has medium viscosity and high thixotropic index.

Product Type: Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Application Method: Injection

Technical Data Sheet
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Identification & Functionality

Product Type

Features & Benefits

Labeling Claims
Product Features
  • Low-temperature curing.
  • Low stress.
  • Low ionic, insulating.
  • Thermal conductive.
  • Epoxy paste adhesive.
  • Insulating die-attach for large and small die.
  • In-line processing of smaller dies and components.
  • Large and small area power devices.

Applications & Uses

Application Area
Application Method
Cure Method
Application Procedures
  • Thaw to ambient temperature for 30 minutes before opening jar or using syringes.
  • Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
  • Cure according to one of the recommended schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 10minutes)min. 1x10¹⁴Ω-cm
Dielectric Strengthmin. 750Volts/mil
Glass Transition Temperature80°C
Glass Transition Temperature81 - 99°C
Device Push Off Strengthmin. 13.8N/mm²
Hardness81 - 99Shore D
Cured Density1.62 - 1.98g/cc
Thermal Conductivity0.765 - 0.935W/m-°C
Thermal Conductivitymin. 1.7W/m-°C
Coefficeint of Linear Thermal Expansion34 - 46ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Pot Life (at 25°C)5Days
Viscosity (at 24°C, 5rpm, Spindle CP51, Thixotropic Index=∼3)16000 - 24000cPsBrookfield Viscometer DV-1
Electrical Resistivitymin. 1x10¹⁴Ω-cm
Die Shear Strengthmin. 2000psi
Viscosity (at 5 rpm)20000cPs

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time
85°C 60 mins
100°C 30 mins
125°C 15 mins
150°C 5 mins

 

Packaging & Availability

Product Availability

ME7665-DA is available in syringes for automatic needle dispense applications or in jars.

Storage & Handling

Shelf Life
1 Year (at -40°C), 3 Months (at 0°C)
Storage Information

Storage temperature: -40 °C, 0°C.