Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Flexible insulating epoxy.
- Two component pastes.
- Thermally conductive.
- Stress-free bonding.
- Available in pre-mixed form.
- Heat-sink attach.
- Substrate & component attaches.
- Large area bonding.
- Bonding adherends with mixmatched CTE's.
- Features & Benefits
- Stress free
- Large Bonding Areas
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Store Part A and Part B at ambient.
- Mix A and B 1:1 by weight. Part A has higher viscosity.
- Cure according to one of the recommended schedules.
- Applications
ME 7556-DA manages heat and stress, while bonding critical components within satellites, particle accelerators, airplanes, as well as cell phones and memory modules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 150°C, 60minutes) | min. 1x10¹⁴ | Ω-cm | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Glass Transition Temperature | -22 to -18 | °C | — |
| Glass Transition Temperature | -20 | °C | — |
| Lap Shear Strength | min. 6.9 | N/mm² | — |
| Device Push Off Strength | min. 12.4 | N/mm² | — |
| Cured Density | 2.07 - 2.53 | g/cc | — |
| Thermal Conductivity | 1.53 - 1.87 | W/m-°C | — |
| Thermal Conductivity | min. 1.7 | W/m-°C | — |
| Coefficeint of Linear Thermal Expansion | 126 - 154 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Average Viscosity (at 25°C, 0.5rpm, Spindle CP51) | 224000 - 336000 | cPs | Brookfield Viscometer DV-1 |
| Electrical Resistivity | min. 1x10¹⁴ | Ω-cm | — |
| Die Shear Strength | min. 1800 | psi | — |
| Viscosity (at 0.5 rpm) | 300000 | cPs | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 25°C 120 hrs 80°C 8 hrs 100°C 4 hrs 125°C 2 hrs 150°C 1 hr - Note
If the material is premixed and frozen thaw for 30 minutes, apply and cure according to one of the recommended cure schedules.
Packaging & Availability
- Product Availability
EG7655 is available in syringes for automatic needle dispense applications or in jars. Upon request, the material can be shipped premixed and frozen.
Storage & Handling
- Shelf Life
- 1 Year (at 25°C)
- Storage Information
Storage temperature: 25°C in sealed package.