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AI Technology ME 8630-DA

ME8630-DA is an extra fine silver filled 100% solid low viscosity die-attach for finer pitch application. It is a low stress, low temperature curable die-attach adhesive paste. This single component, silver filled paste is electrically and thermally conductive. It is highly thixotropic with outstanding compatibility for bonding different adherends. The relatively medium Tg and modulus made it suitable for bonding both smaller and relatively large devices. ME8630-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes. It maintains more than 300 psi bond strength at 250°C for high temperature wire-bonding.

Product Type: Conductive Adhesive, Solvent free (100% Solids) Adhesive, Thermal Adhesive

Application Area: Die/Chip Attach, LEDs

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Product Features
    • 100% solid.
    • Low viscosity.
    • Fine pitch with extra-fine silver.
    • Long pot-life.
    • In-line die-attach.
    • Large and small dies.
    • Stamping dispensing.
    • LED and other smaller dies.

    Applications & Uses

    Application Area
    Application Procedures
    • Thaw to ambient temperature for 30 minutes before opening jar or dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
    • Cure according to the recommended schedules.

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Electrical Resistivitymax. 4x10⁻⁴Ω-cm
    Thermal Conductivitymin. 8.6W/m-°C
    Die Shear Strengthmin. 2400psi
    Glass Transition Temperature80°C
    Viscosity (at 5 rpm, Thixotropic Index=>4)8000cPs
    Electrical Resistivity (at 150°C, 30minutes)max. 4x10⁻⁴Ω-cm
    Current Carrying Capabilitiesmin. 20Amp/mm²
    Device Push Off Strengthmin. 16.6N/mm²
    Hardness80Shore D
    Cured Density3.5g/cc
    Coefficeint of Linear Thermal Expansion40ppm/°C
    Maximum Continuous Operation Temperature150°C
    Average Viscosity (at 24°C, 0.5rpm, Spindle CP51)8000cPsBrookfield Viscometer DV-1

    Regulatory & Compliance

    Certifications & Compliance

    Technical Details & Test Data

    Cure Schedules
    Temperature Time
    100°C 2 hrs
    125°C 60 mins
    150°C 30 mins
    175°C 5 mins

    Packaging & Availability

    Product Availability

    ME8630-DA is available in syringes for automatic needle dispense applications or in jars.

    Storage & Handling

    Shelf Life
    1 Year (at -40°C), 30 Days (at 25°C)
    Storage Information

    Storage temperature: -40°C, 25°C.