Products

127-20 is a two component, pad printable, conductive ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to Polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 127-20 include, but are not limited to, emi/rfi shielding, flexible circuits, and membrane switches.Features Low temp curing, adhesion to difficult substrates

128-06(PP) is a pad printable, electrically conductive, medical grade ink, and coating, suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing in both mechanical and electrical stability. Some applications for 128- 06(PP) include, but are not limited to, transdermal drug delivery, ECG electrodes, tens electrodes and muscle stimulator electrodes. 128-06(PP) is a pad printable version of 113-09T.Features Electrode ink

128-38 is a screen-printable, B-Stageable, one-part epoxy coating and laminating adhesive that maintains hermetic properties up to 170°C. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include lid attach adhesives, printed circuit board fabrication, advanced material composites, sealing, and high-performance coatings.Features Hermetic properties B-Stageable Long Screen Life High Tg Hermetic lid attach

118-43(LPS) is an extremely flexible, pad printable, electrically conductive ink, coating and adhesive suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 118-43(LPS) include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and anode coatings for tantalum capacitors. 118-43(LPS) is a crosslinking version of 118-43T.Features Extremely flexible electrically conductive ink, ideal for elastomeric and difficult substrates.

115-02 is a silver/ silver chloride, based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 115-02 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments, medical electrodes and static elimination. 115-02 is a silver / silver chloride version of 114-50.Features Electrode ink for ECG electrodes

108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound

109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound

119-28 is an extremely flexible, pad printable, electrically conductive, carbon filled ink, coating and adhesive suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 119-28 include, but are not limited to, polymer thick film circuitry and membrane switches. 119-28 is a pad-printable version of 108-46.Features Very flexible resistive ink

128-31 is a screen-printable high dielectric constant ink, and coating. This product features excellent adhesion to ITO (Indium Tin Oxide) sputtered surfaces, Kapton®, Mylar®, glass and a variety of other surfaces. Unlike conventional materials, this product is very resistant to flexing, and creasing.Features High dielectric constant ink for low temperature substrates.

126-22 is a pre-catalyzed, solvent-resistant, anisotropic conductive adhesive. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern.Features Solvent resistant epoxy adhesive Ideal for LED bonding

128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

128-17A/B is a two-part, room temperature curing, silver-filled fast curing adhesive. This system is designed for making electrical and mechanical attachments on electrical components and devices and features a very quick setup time allowing for rapid processing and repair in a variety of applications. 128-17A/B features a volumetric 3-to-2 mix ratio, allowing it to be easily handled by most mixing equipment.Features Fast curing, room temperature curing conductive adhesive

124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength Increased flexibility

127-04 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features B-Stageable laminating adhesive

127-48D is a matte finish, flexible, electrically insulating ink and coating suitable for application by screen printing, dipping, and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, polycarbonate, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing. Some applications for 127-48D include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, and membrane switches. 127-48D is a thermosetting version of 124- 18T.Features Solvent resistant washable dielectric ink ideal for fabrics

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

110-04 is a carbon-based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for110-04 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, resistance heaters, polymer thick film circuitry, membrane switches, electrical attachments and static elimination.Features Solvent based resistive ink

114-29 A/B is a two component, pad printable, radio opaque ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 114-29 A/B include, but are not limited to, manufacturing of medical devices and instruments.Features Abrasion resistant, solvent resistant ideal for PEEK and similar substrates

124-02 is a waterborne, low V.O.C., electrically conductive ink and coating suitable for application by rotogravure or flexographic. This product features adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 124-02 include, but are not limited to, medical electrodes, EMI/RFI shielding, polymer thick film circuitry and membrane switches. 124-02 is a higher viscosity version of 119-32.Features Water based conductive ink

128-32-50 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-50 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-50 is optimized for a 0.002” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance B-stageable epoxy adhesive, ideal for 50µm bond line

123-34 is a pad-printable, B-Stageable, one part epoxy coating and adhesive, suitable for application by pad printing, dipping and syringe dispensing. This system has been pre-catalyzed with CMI 119-44 to allow for low temperature cure. This product features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. 123-34 is a pre-catalyzed version of 122- 48.Features B-Stageable Epoxy Adhesive

The 805-19C is a one-component, high performance, silver filled room temperature curable epoxy adhesive.Features One component room temperature curing

114-29B A/B is a two component, pad printable, blue radio opaque ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 114-29B A/B include, but are not limited to, manufacturing of medical devices and instruments. 114-29B is a blue version of 114-29.Features Abrasion resistant, blue, solvent resistant & ideal for PEEK and similar substrates

108-50 is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50 can also be used as an adhesive for bonding stress sensitive substrates.Features Low stress, moderate thermally conductive adhesive/potting compound

124-22C is a pre catalyzed, solvent-resistant, anisotropic conductive ink, coating and adhesive. This product features excellent adhesion to Kapton, Mylar, glass, polycarbonate and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. It is also very resistant to scratching and creasing. Applications for 124-22C include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. This product is useful in application where shorts between closely spaced contacts is a concern.Features Solvent resistant, low temperature curing epoxy adhesive

122-01(P) is a single component, electrically insulating, solvent strippable, polyimide based, ink and coating suitable for application by screen-printing, dipping and syringe dispensing. This product is designed for use on electrical and electronic components where high temperature stability is required. The low CTE and high flexibility allow for good adhesion and low stress when exposed to high temperatures. 122-01(P) is a flexible version of CMI 122-01.Features Polyimide dielectric High flexibility

127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive

102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity

The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.

The 810-44-2 System is a two component (A + B) high performance, thermally conductive, room temperature curing epoxy adhesive and potting compound. This is a higher viscosity version of 810-44.FeaturesTwo component, low CTE, low flow epoxy adhesive.

127-11 is a medical electrode ink and coating suitable for application by wire coating, dipping and flexographic or gravure printing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike most readily available electrode inks, this product is able to maintain conductivity levels in contact with high salt content electrode adhesive gel. This product is designed to produce uniform smooth surfaces in thin layers and to be fast curing at low temperatures. Some uses for 127-11 include, but are not limited to, EKG and Tens electrode applications as well as other medical devices.Features Electrode ink for ECG electrodes

125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive

128-32FP is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32FP include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. 128-32FP is especially useful in applications where shorts between closely spaced contacts is a concern and it features a finer pitch than traditional anisotropic conductive materials. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32FP is able to be used with pad sizes as small as 70 μm and spaces as fine as 30 μm.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

102-12/B-187 is a black, two component, thermally conductive epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12/B-187 exhibits excellent thermal shock resistance and is especially suited to protecting sensitive electronic devices from a range of operating conditions including moisture, vibration, and temperature variation. Other useful applications include, but are not limited to, potting relays, electronic controls, sensors, and inverters and sealing of electronic component housings. Using B-187 allows for faster curing compared to B119-44.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.

119-07 is a black, pad-printable, one component, high dielectric strength, epoxy ink and coating. This product features excellent adhesion to Kapton, Mylar, aluminum, FR-4 boards, glass and a variety of other substrates. Unlike conventional dielectric materials, this product is very resistant to abrasion, scratching, and thermal aging. Applications for 119-07 include, but are not limited to, high dielectric strength coatings for electrical and electronic devices. 119-07 is designed for pad printing onto contoured surfaces.Features High dielectric strength coating/ink

127-49A/B is an electrically conductive, two-component, silicone ink and coating suitable for high temperature applications. 127-49A/B is suitable for application via syringe dispensing and screen printing. Unlike typical conductive inks, the high temperature capability of this product makes it useful in a range of unique applications such as extreme performance coatings. 127-49A/B is also able to cure at room temperature.Features Two part, room temperature curing silicone conductive adhesive.