Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
- Application Method
- Compatible Substrates & Surfaces
- Cure Method
- B-stage Procedure
Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when cooled to room temperature. A temperature of 100°C to 120°C for 5 to 15 minutes is required, B-Stage time is mass related. User is encouraged to experiment for optimum drying time at a given temperature.
- Bonding Procedure
To use, apply b-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain location. Cure for 15 minutes at 200°C, or 30 minutes at 175°C, or 1 hour at 150°C. For better adhesion of the bstaged film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing should start after adhesive and substrates reach curing temperature.
Properties
- Typical Properties
- Uncured Properties
- Typical Cured Properties
| Value | Units | Test Method / Conditions | |
| Pot Life | Latent | — | — |
| Conductivity | 4.3 | W/mK | — |
| Value | Units | Test Method / Conditions | |
| Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C) | 20,000 - 30,000 | cps | — |
| Specific Gravity (water = 1) | 1.71 | g/cc | — |
| Theoretical Coverage (at 0.001" Thickness) | 35 | in^2 | — |
| Screen Life | min. 8 | hrs | — |
| Filler | Aluminum Nitride | — | — |
| Value | Units | Test Method / Conditions | |
| Volume Resistivity | 1x 10^16 | Ω - cm | — |
| Dielectric Constant (1 KHz) | 4.1 | — | — |
| Dielectric Constant (1 MHz) | 3.9 | — | — |
| Dissipation Factor (1 KHz) | 0.027 | — | — |
| Dissipation Factor (1 MHz) | 0.038 | — | — |
| Thermal Conductivity | 4.3 | W/mK | — |
| Percent Filler (cured) | 65 | — | — |
| Thermal Stability | Good to 325 | °C | — |
| Useful Temperature Range | -55 to 230 | ºC | — |
| Glass Transition Temperature (Tg) | 150 | °C | — |
| Coefficient of Thermal Expansion below Tg | 50 x 10^-6 | in/in/°C | — |
| Coefficient of Thermal Expansion above Tg | 60 x 10^-6 | in/in/°C | — |
| Tensile Shear Strength | min. 2000 | Psi | — |
| Peel Strength (Copper to copper at 90°) | 9 | Pli | — |
Regulatory & Compliance
- Certifications & Compliance
Safety & Health
- Safety & Handling
- Use with adequate ventilation.
- Keep away from sparks and open flames.
- Avoid prolonged contact with skin and breathing of vapors.
- Wash with soap and water to remove from skin.
Storage & Handling
- Curing Guidelines
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
Temperature (°C) Time (min.) 150 60 175 30 200 15 - Handling And Storage
Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful not entrap air while mixing. 127-03 can be thinned with small amounts of CMI 113-12 (fast drying), or 102-03 (slow drying) thinners.
Shelf Life
Storage Temperature Containers B-Staged Film 25°C 2 months 1 month -10°C 6 months 3 months