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Creative Materials 128-32-25

128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001” bond line.

Features

  • Minimal flow during cure
  • Low Cure Temperature
  • B-Stageable
  • Long Screen Life
  • Excellent Chemical Resistance
  • Excellent Room Temperature Stability

Product Type: Conductive Adhesive, Epoxy Adhesive

Application Area: Electrical Components, Ribbon Cables

Compatible Substrates & Surfaces: Metal

Application Method: Dip Coating, Injection, Screen Coating

Chemical Family: Epoxy & Epoxy Derivatives

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Applications & Uses

    Compatible Substrates & Surfaces
    B-stage Procedure

    Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when cooled to room temperature. A temperature of 50 – 65°C for 5 to 15 minutes is required, B-Stage time is mass related. User is encouraged to experiment for optimum drying time at a given temperature. For increased surface adhesion to some substrates CMI 126-39 can be used.

    Bonding Procedure

    To use, apply B-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain location. Cure at one of the above cure schedules. For better adhesion of the b-staged film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing should start after adhesive and substrates reach curing temperature.

    Application Method
    • Screen-print

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Minimum Cure Temperature80°C
    Uncured Properties
    ValueUnitsTest Method / Conditions
    Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C)15,000 - 25,000cps
    Specific Gravity (water = 1)1.17g/cc
    Theoretical Coverage (at 0.001" Thickness)35in^2
    Screen Lifemin. 8hrs
    FillerSilver
    Typical Cured Properties
    ValueUnitsTest Method / Conditions
    Volume Resistivity (X and Y Axis)1x 10^16Ω - cm
    Volume Resistivity (Z) Axis0.0001Ω - cm
    Thermal StabilityGood to 325°C
    Useful Temperature Range-55 to 230ºC
    Glass Transition Temperature (Tg)105°C
    Tensile Shear Strengthmin. 2000Psi

    Regulatory & Compliance

    Certifications & Compliance

    Safety & Health

    Safety & Handling
    • Use with adequate ventilation.
    • Keep away from sparks and open flames.
    • Avoid prolonged contact with skin and breathing of vapors.
    • Wash with soap and water to remove from skin.

    Storage & Handling

    Curing Instructions

    These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.

    Temperature (°C) Time (min.)
    80 60
    100 20
    120 3
    150 1
    175 0.5
    Handling And Storage

    Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful not entrap air while mixing. 128-32FP can be thinned with small amounts of CMI 113-12 (fast drying), or 102-03 (slow drying) thinners.

    Storage Temperature Containers B-Staged Film
    25°C <3 months <1 month
    -10°C <12 months <3 months