Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Application Area
- Application Method
- Cure Method
- B-stage Procedure
Apply adhesive to substrate. Apply heat to advance curing to the non-tacky stage (when cooled to room temperature). A temperature of 125º C for 2 – 3 minutes is required (B-stage time is mass related). The user is encouraged to experiment for optimum drying time at a given temperature. Store on release liner to prevent contamination.
- Bonding Procedure
To use, carefully align parts to be bonded, apply uniform pressure to maintain location. Follow curing guidelines given above. Timing should start once adhesive and substrate reach curing temperature.
- Details
- As with all adhesive bonds, surface preparation is a vital part of the process. Carefully clean both surfaces to be bonded with MEK if possible. If MEK is not compatible with the surfaces to be bonded, another suitable solvent may be used.
- Allow cleaned surfaces to dry completely.
- Die cut 118-06(SD) to the of the size of interface area, remove one of the protective liners, position onto one of the surfaces to be bonded, and warm the substrate/adhesive to 50°C-70°C.
- By applying slight pressure, laminate the film/adhesive to the substrate smoothing out any trapped air. Allow to cool to room temperature and peel off the other release liner.
- Position the other substrate and apply a clamp to provide constant pressure.
- Cure per previous guidelines.
- Remove pressure. Part is ready for use
Properties
- Color
- Silver
- Typical Properties
- Uncured Properties
- Typical Cured Properties
| Value | Units | Test Method / Conditions | |
| Pot Life | Latent | - | - |
| Conductivity | 0.0002 | - | - |
| Chloride | max. 10 | ppm | - |
| Sodium Content | max. 10 | ppm | - |
| Potassium Content | max. 10 | ppm | - |
| Value | Units | Test Method / Conditions | |
| Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C) | 85000 | cps | - |
| Specific Gravity | 2.49 | water = 1 | - |
| Theoretical Coverage (at 0.001" Thickness) | 20 | in^2/gram | - |
| Filler | Silver | - | - |
| Percent Silver (cured) | min. 74 | % | - |
| Solid Content | 90 | % | - |
| Value | Units | Test Method / Conditions | |
| Operating Temperature | -55 to +230 | °C | - |
| Peak Temperature | 325 | °C | - |
| Volume Resistivity | 0.0002 | Ω - cm | - |
| Glass Transition Temperature (Tg) | 100 | °C | - |
| Coefficient of Thermal Expansion | 50 | ppm/ºC | - |
| T-Shear Strength | 2100 | psi | - |
| Weight Loss (at 300°C, TGA) | 2.77 | % | - |
| Differential Scanning Calorimetry (DSC) Peak Tc | 168 | ºC | - |
| Differential Scanning Calorimetry (DSC) ∆ Hc | -33.4 | J/g | - |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Test Data
Safety & Health
- Safety & Handling
- Use with adequate ventilation.
- Keep away from sparks and open flames.
- Avoid prolonged contact with skin and breathing of vapors.
- Wash with soap and water to remove from skin.
Storage & Handling
- Curing Guidelines
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
Temperature (ºC) Time (min.) 150 60 175 30 200 15 - Handling And Storage
118-06(SD) is a one component epoxy system and is ready to use as received. Product should be stored frozen to maintain consistent flow properties. Allow 118-06(SD) to warm up to room temperature before opening container. Prior to using, mix thoroughly to re-suspend fillers. If needed, 118-06(SD) can be thinned with small amounts of Creative Materials’ 102-03 thinner.
Storage Temperature Containers Syringes B-Staged Film 25°C 2 months N/A ≤ 10 days -10°C 6 months 6 months ≤ 3 months