Products

127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive

127-49A/B is an electrically conductive, two-component, silicone ink and coating suitable for high temperature applications. 127-49A/B is suitable for application via syringe dispensing and screen printing. Unlike typical conductive inks, the high temperature capability of this product makes it useful in a range of unique applications such as extreme performance coatings. 127-49A/B is also able to cure at room temperature.Features Two part, room temperature curing silicone conductive adhesive.

108-50MG is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50MG features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50MG can also be used as an adhesive for bonding stress sensitive substrates when low ionics or low hydrolyzable chloride is required. 108- 50MG is a microelectronics grade version of 108-50.Features Microelectronics grade Low stress Moderate thermally conductive adhesive/potting compound

128-06(PP) is a pad printable, electrically conductive, medical grade ink, and coating, suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing in both mechanical and electrical stability. Some applications for 128- 06(PP) include, but are not limited to, transdermal drug delivery, ECG electrodes, tens electrodes and muscle stimulator electrodes. 128-06(PP) is a pad printable version of 113-09T.Features Electrode ink

109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound

118-43(LPS) is an extremely flexible, pad printable, electrically conductive ink, coating and adhesive suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 118-43(LPS) include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and anode coatings for tantalum capacitors. 118-43(LPS) is a crosslinking version of 118-43T.Features Extremely flexible electrically conductive ink, ideal for elastomeric and difficult substrates.

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

127-48D is a matte finish, flexible, electrically insulating ink and coating suitable for application by screen printing, dipping, and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, polycarbonate, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing. Some applications for 127-48D include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, and membrane switches. 127-48D is a thermosetting version of 124- 18T.Features Solvent resistant washable dielectric ink ideal for fabrics

119-28 is an extremely flexible, pad printable, electrically conductive, carbon filled ink, coating and adhesive suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 119-28 include, but are not limited to, polymer thick film circuitry and membrane switches. 119-28 is a pad-printable version of 108-46.Features Very flexible resistive ink

127-20 is a two component, pad printable, conductive ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to Polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 127-20 include, but are not limited to, emi/rfi shielding, flexible circuits, and membrane switches.Features Low temp curing, adhesion to difficult substrates

128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength Increased flexibility

128-17A/B is a two-part, room temperature curing, silver-filled fast curing adhesive. This system is designed for making electrical and mechanical attachments on electrical components and devices and features a very quick setup time allowing for rapid processing and repair in a variety of applications. 128-17A/B features a volumetric 3-to-2 mix ratio, allowing it to be easily handled by most mixing equipment.Features Fast curing, room temperature curing conductive adhesive

114-29 A/B is a two component, pad printable, radio opaque ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 114-29 A/B include, but are not limited to, manufacturing of medical devices and instruments.Features Abrasion resistant, solvent resistant ideal for PEEK and similar substrates

122-01(P) is a single component, electrically insulating, solvent strippable, polyimide based, ink and coating suitable for application by screen-printing, dipping and syringe dispensing. This product is designed for use on electrical and electronic components where high temperature stability is required. The low CTE and high flexibility allow for good adhesion and low stress when exposed to high temperatures. 122-01(P) is a flexible version of CMI 122-01.Features Polyimide dielectric High flexibility

124-19 is a two part, room temperature curing, anisotropic conductive epoxy adhesive. The system is designed for making electrical and mechanical attachments on electrical components and devices. Unlike typical room temperature curing systems, this product always results in excellent anisotropic conductivity and is less sensitive to handling and ambient conditions. Complimentary B components allow for customization of end properties. Use B2713 for more flexibility and lower stress; use the standard B component for high strength requirements.Features Room temperature curing High bond strength

125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive

128-32FP is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32FP include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. 128-32FP is especially useful in applications where shorts between closely spaced contacts is a concern and it features a finer pitch than traditional anisotropic conductive materials. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32FP is able to be used with pad sizes as small as 70 μm and spaces as fine as 30 μm.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

128-19 is a screen-printable, B-stageable, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 128-19 is designed to exhibit minimal flow during bonding. This product provides bonds of dissimilar materials and has has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 128-19 is an electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance laminating adhesive

121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 121-23 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product is useful in application where shorts between closely spaced contacts are a concern. This system features excellent thermal stability.Features B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate

108-50 is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50 can also be used as an adhesive for bonding stress sensitive substrates.Features Low stress, moderate thermally conductive adhesive/potting compound

114-29B A/B is a two component, pad printable, blue radio opaque ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 114-29B A/B include, but are not limited to, manufacturing of medical devices and instruments. 114-29B is a blue version of 114-29.Features Abrasion resistant, blue, solvent resistant & ideal for PEEK and similar substrates

119-10 is a pad printable, electrically conductive, medical grade ink, and coating, suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 119-10 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and anode coatings for tantalum capacitors as well as medical electrode applications. 119-10 is a pad-printable version of 108-38.Features Electrode ink

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

128-32-50 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-50 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-50 is optimized for a 0.002” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance B-stageable epoxy adhesive, ideal for 50µm bond line

122-39(SD) is a syringe dispensable, thermally conductive, electrically insulating, one component, 100% solids epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach and thermal management operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-39(SD) is a thermally conductive version of 122- 38(SD).Features Ionically clean die attach adhesive

The 805-19C is a one-component, high performance, silver filled room temperature curable epoxy adhesive.Features One component room temperature curing

123-34 is a pad-printable, B-Stageable, one part epoxy coating and adhesive, suitable for application by pad printing, dipping and syringe dispensing. This system has been pre-catalyzed with CMI 119-44 to allow for low temperature cure. This product features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. 123-34 is a pre-catalyzed version of 122- 48.Features B-Stageable Epoxy Adhesive

126-37 is a screen-printable, B-Stageable, anisotropic conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 126-37 is an anisotropic conductive version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance

126-08 is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Extremely high thermally conductive epoxy adhesive

114-29G A/B is a two component, pad printable, green radio opaque ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 114-29G A/B include, but are not limited to, manufacturing of medical devices and instruments. 114-29G is a green version of 114-29.Features Abrasion resistant, green, solvent resistant & ideal for PEEK and similar substrates

125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.Features Highly thermally conductive epoxy adhesive B-Stageable Low temperature curing

102-32NFC is a flexible electrically conductive silicone adhesive. 102-32NFC features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of the product. Some applications for 102-32NFC include, but are not limited to, elastomeric conductive bridging and bonding, conductive bonding of low surface energy materials, conductive via filling and electrical attachments for stress sensitive devices. 102-32NFC is one of the few conductive adhesives that can bond to silicone substrates and surfaces. 102-32NFC is a non-flammable version of 102-32.Features High temperature Flexible silicone adhesive Non-flammable.

122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive, epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, die attachment, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components.Features Ionically clean die attach adhesive

128-21C is a jet or syringe dispensable, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 128-21C is flexible and can absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 128-21C is a version of 125-31C optimized for jet dispensing.Features Low stress thermally highly thermally conductive epoxy adhesive

102-32 is a flexible, reworkable, electrically conductive, silicone pressure sensitive adhesive. The overall balance of peel strength, cohesion, lap shear strength and high temperature holding power provides a versatility that makes this product useful in a wide range of fastening and bonding applications. This product is very resistant to flexing and creasing. Some applications for 102-32 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, and electrical attachments for stress sensitive devices. 102-32 is one of the few conductive adhesives that can bond to silicone substrates and surfaces. In addition, it can be bonded to some types of Teflon® surfaces.Features High temperature flexible silicone adhesive.