Products

127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive

115-02 is a silver/ silver chloride, based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 115-02 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments, medical electrodes and static elimination. 115-02 is a silver / silver chloride version of 114-50.Features Electrode ink for ECG electrodes

128-38 is a screen-printable, B-Stageable, one-part epoxy coating and laminating adhesive that maintains hermetic properties up to 170°C. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include lid attach adhesives, printed circuit board fabrication, advanced material composites, sealing, and high-performance coatings.Features Hermetic properties B-Stageable Long Screen Life High Tg Hermetic lid attach

118-43(LPS) is an extremely flexible, pad printable, electrically conductive ink, coating and adhesive suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 118-43(LPS) include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and anode coatings for tantalum capacitors. 118-43(LPS) is a crosslinking version of 118-43T.Features Extremely flexible electrically conductive ink, ideal for elastomeric and difficult substrates.

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

127-04 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features B-Stageable laminating adhesive

119-28 is an extremely flexible, pad printable, electrically conductive, carbon filled ink, coating and adhesive suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 119-28 include, but are not limited to, polymer thick film circuitry and membrane switches. 119-28 is a pad-printable version of 108-46.Features Very flexible resistive ink

127-20 is a two component, pad printable, conductive ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to pretreated polyethylene, and polypropylene, as well as to some varieties of pretreated polytetrafluoroethylene. This material will also adhere to Polyurethane, polyamide, melamine, phenolic resins, metal, and glass substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, flexing and creasing. Some applications for 127-20 include, but are not limited to, emi/rfi shielding, flexible circuits, and membrane switches.Features Low temp curing, adhesion to difficult substrates

128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

110-04 is a carbon-based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for110-04 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, resistance heaters, polymer thick film circuitry, membrane switches, electrical attachments and static elimination.Features Solvent based resistive ink

125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive

128-32FP is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32FP include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. 128-32FP is especially useful in applications where shorts between closely spaced contacts is a concern and it features a finer pitch than traditional anisotropic conductive materials. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32FP is able to be used with pad sizes as small as 70 μm and spaces as fine as 30 μm.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance Excellent Room Temperature Stability

128-19 is a screen-printable, B-stageable, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 128-19 is designed to exhibit minimal flow during bonding. This product provides bonds of dissimilar materials and has has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 128-19 is an electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance laminating adhesive

121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 121-23 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product is useful in application where shorts between closely spaced contacts are a concern. This system features excellent thermal stability.Features B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate

124-02 is a waterborne, low V.O.C., electrically conductive ink and coating suitable for application by rotogravure or flexographic. This product features adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 124-02 include, but are not limited to, medical electrodes, EMI/RFI shielding, polymer thick film circuitry and membrane switches. 124-02 is a higher viscosity version of 119-32.Features Water based conductive ink

119-10 is a pad printable, electrically conductive, medical grade ink, and coating, suitable for application by pad printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 119-10 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments for surface mounted devices, and anode coatings for tantalum capacitors as well as medical electrode applications. 119-10 is a pad-printable version of 108-38.Features Electrode ink

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

128-32-50 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-50 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-50 is optimized for a 0.002” bond line.Features Minimal flow during cure Low Cure Temperature B-Stageable Long Screen Life Excellent Chemical Resistance B-stageable epoxy adhesive, ideal for 50µm bond line

122-39(SD) is a syringe dispensable, thermally conductive, electrically insulating, one component, 100% solids epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach and thermal management operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-39(SD) is a thermally conductive version of 122- 38(SD).Features Ionically clean die attach adhesive

123-34 is a pad-printable, B-Stageable, one part epoxy coating and adhesive, suitable for application by pad printing, dipping and syringe dispensing. This system has been pre-catalyzed with CMI 119-44 to allow for low temperature cure. This product features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. 123-34 is a pre-catalyzed version of 122- 48.Features B-Stageable Epoxy Adhesive

119-07 is a black, pad-printable, one component, high dielectric strength, epoxy ink and coating. This product features excellent adhesion to Kapton, Mylar, aluminum, FR-4 boards, glass and a variety of other substrates. Unlike conventional dielectric materials, this product is very resistant to abrasion, scratching, and thermal aging. Applications for 119-07 include, but are not limited to, high dielectric strength coatings for electrical and electronic devices. 119-07 is designed for pad printing onto contoured surfaces.Features High dielectric strength coating/ink

126-37 is a screen-printable, B-Stageable, anisotropic conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 126-37 is an anisotropic conductive version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance

126-08 is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Extremely high thermally conductive epoxy adhesive

124-43 is a carbon filled waterborne, low V.O.C., electrically conductive ink and coating, suitable for application by flexographic methods. This product features adhesion to Kapton, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 124-43 include, but are not limited to, medical electrodes, polymer thick film circuitry, and membrane switches and static elimination.Features Water based resistive ink

125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.Features Highly thermally conductive epoxy adhesive B-Stageable Low temperature curing

102-32NFC is a flexible electrically conductive silicone adhesive. 102-32NFC features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of the product. Some applications for 102-32NFC include, but are not limited to, elastomeric conductive bridging and bonding, conductive bonding of low surface energy materials, conductive via filling and electrical attachments for stress sensitive devices. 102-32NFC is one of the few conductive adhesives that can bond to silicone substrates and surfaces. 102-32NFC is a non-flammable version of 102-32.Features High temperature Flexible silicone adhesive Non-flammable.

122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive, epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, die attachment, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components.Features Ionically clean die attach adhesive

110-03 is a silver-based electrically conductive ink and coating suitable for application by flexographic and rotogravure printing methods. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 110-03 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments and static elimination.Features Solvent based conductive ink

128-21C is a jet or syringe dispensable, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 128-21C is flexible and can absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 128-21C is a version of 125-31C optimized for jet dispensing.Features Low stress thermally highly thermally conductive epoxy adhesive

124-17 is a flexible, pad printable radio opaque ink/coating for application by pad printing, dipping and syringe dispensing. The product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, and thermal aging. Some applications for 124-17 include, but are not limited to, manufacturing of medical devices and instruments.Features Abrasion resistant, solvent resistant epoxy ink

117-31 is a pad-printable, electrically conductive ink and coating which is suitable for applications requiring subsequent plating operations. The product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching and thermal aging. Some applications for 117-31 include, but are not limited to, electroless, and electrolytic plating, anode and cathode coatings for capacitors, and as an underlying coating to prepare surfaces for plating and subsequent soldering. 117-31 can also be used as an underlying coating for decorative plating on various substrates.Features Plateable conductive ink

119-31TS is an extremely flexible, pad printable radio opaque ink and coating for application by pad printing and syringe dispensing. The product features excellent adhesion to PEBAX, Kapton, Mylar, glass and a variety of other substrates. Unlike conventional materials this product offers a balance of properties featuring excellent toughness high flexing, crease, and abrasion resistance as well as the ability to elongate and stretch. These properties make 119-31TS well suited for applications including, but not limited to, manufacturing of markers for medical devices and fluoroscopy as well as shielding for security applications. 119-31TS is a more chemically resistant version of 119-31T.Features Very flexible, low temperature curing, ideal for urethane, increased solvent resistance

124-35 is a flexible, re-workable, silicone-based radiopaque ink. The overall balance of peel strength, cohesion, printability, and high temperature holding power provides a versatility that makes this product useful in a wide range of applications. 124-35 is resistant to flexing and creasing and features excellent adhesion to difficult to bond to surfaces such as PEBAX, silicone, PVC and some grades of Teflon®.Features Elastomeric ink with adhesive properties and ideal for silicone substrates

124-07 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features Screen-print

124-25 is a flexible, radio opaque ink/coating for application syringe dispensing. The product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to abrasion, scratching, and thermal aging. Some applications for 124-25 include, but are not limited to, manufacturing of medical devices and instruments.Features Abrasion resistant, solvent resistant epoxy ink

106-12 is a silver/carbon-based electrically conductive ink, coating and adhesive suitable for application by stamping, screen printing, dipping and syringe dispensing. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 106-12 include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, membrane switches, electrical attachments and static elimination.Features Standard electrode material for ECG