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Creative Materials 125-22C119-44

125-22C119-44 is a screen-printable, B-Stageable, electrically conductive, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 125-22C119-44 is designed to exhibit minimal flow during bonding. This product provides superior electrical and thermal conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 125-22C119-44 is 125-22 with 2% by weight B119-44 added for reduced cure times and temperatures.

Features

  • Minimal flow during cure
  • Low CTE
  • B-Stageable
  • Long Screen Life
  • Excellent Chemical Resistance
  • Excellent High Temperature Performance
  • Lower temperature curing version of 125-22

Product Type: 1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive

Application Area: Electrical Components

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Ceramic, Copper, Metal

Application Method: Injection, Screen Coating

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces
Cure Method
B-stage Procedure

Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when cooled to room temperature. A temperature of 70 – 85°C for 5 to 15 minutes is required, B-Stage time is mass related. User is encouraged to experiment for optimum drying time at a given temperature. For increased surface adhesion to some substrates CMI 126-39 can be used.

Bonding Procedure

To use, apply B-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain location. Cure at one of the above cure schedules. For better adhesion of the b-staged film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing should start after adhesive and substrates reach curing temperature.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Pot LifeLatent
Conductivity0.001
Uncured Properties
ValueUnitsTest Method / Conditions
Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C)20,000 - 30,000cps
Specific Gravity1.88g/cc
Theoretical Coverage (at 0.001" Thickness)approx. 30in^2
Screen Lifemin. 8hrs
FillerSilver
Volume Resistivitymax. 0.001Ω - cm
Thermal Conductivity6.5W/mK
Percent Silver (cured)min. 60
Typical Cured Properties
ValueUnitsTest Method / Conditions
Thermal StabilityGood to 325°C
Useful Temperature Range-55 to 230ºC
Glass Transition Temperature (Tg)150ºC
Coefficient of Thermal Expansion below Tg50 x 10^-6in/in/°C
Coefficient of Thermal Expansion above Tg60 x 10^-6in/in/ºC
Tensile Shear Strengthmin. 2000Psi
Peel Strength (Copper to copper at 90°)9Pli

Regulatory & Compliance

Certifications & Compliance

Safety & Health

Safety & Handling
  • Use with adequate ventilation.
  • Keep away from sparks and open flames.
  • Avoid prolonged contact with skin and breathing of vapors.
  • Wash with soap and water to remove from skin.

Storage & Handling

Curing Instructions

These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.

Temperature (ºC) Time (min.)
100 60
125 30
150 15
175 5
200 3
Handling And Storage

Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful not entrap air while mixing. 125-22C119-44 can be thinned with small amounts of CMI 113-12 (fast drying), or 102- 03 (slow drying) thinners.

Storage Temperature Containers B-Staged Film
25°C ≤ 7 days ≤ 10 days
-10°C ≤ 6 months ≤ 3 months