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Creative Materials 126-37-F

126-37-F is an anisotropically conductive transferable low CTE adhesive film. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. This system features excellent thermal stability and flexibility in the B-Staged form. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. The product can be re-bonded many times by simply adding heat and slight pressure

Product Type: Conductive Adhesive, Epoxy Adhesive

Application Area: Electrical Components

Compatible Substrates & Surfaces: Aluminum, Ceramic, Glass, Metal, Plastics, Polyimide

Chemical Family: Epoxy & Epoxy Derivatives

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Applications & Uses

    Application Area
    Compatible Substrates & Surfaces
    Procedure for Applying

    1. As with all adhesive bonds, surface preparation is a vital part of the process. Carefully clean both surfaces to be bonded with MEK if possible. If MEK is not compatible with the surfaces to be bonded, another suitable solvent may be substituted.
    2. Allow cleaned surfaces to dry for approximately 2-3 minutes.
    3. Locate the adhesive onto the preheated substrate(s). Smooth out any trapped air by hand, with a roller or any other smoothing device. Some pressure is advisable to ensure intimate contact between the adhesive and substrate
    4. Place the two surfaces together and cure using the guidelines above and enough pressure to hold the surfaces tightly together. Lower temperatures may be used but the cure times will be longer.
    5. Allow to cool to room temperature under the same pressure.
    6. Remove pressure. Part is ready for use.

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Glass Transition Temperature (Tg)150°C-
    Typical Cured Properties
    ValueUnitsTest Method / Conditions
    Volume Resistivity (X and Y Axis)1x10^12Ω – cm-
    Volume Resistivity (Z Axis)0.0001Ω – cm-
    Thermal StabilityGood to 325°C-
    Useful Temperature Range55 to 230ºC-
    Coefficient of Thermal Expansion below Tg50 x 10^-6in/in/C-
    Coefficient of Thermal Expansion above Tg60 x 10^-6in/in/C-
    Tensile Shear Strengthmin. 2000Psi-

    Regulatory & Compliance

    Certifications & Compliance

    Technical Details & Test Data

    General Film Description

    Substrate Type: PET Release Liner
    Conductive Coating Type: Silver/Polymer

    Product Code

    Adhesive Thickness (mils)

    126-37-F1 1
    126-37-F2 2
    126-37-F3 3
    126-37-F4 4
    126-37-F5 5

    Storage & Handling

    Curing Guidelines
    Temperature (°C) Time (min.)
    160 60
    175 30
    200 15

    These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.

    Shelf Life
    Storage Temperature B-Staged Film
    25°C 1 month
    -10°C 3 months