Products

114-26 B is a medical grade, electrically conductive, polymer coated polyester film composition. It is typically used as a component for fabricating electrodes in medical testing applications. This product has been formulated to have improved conductivity and high electrical dissipation properties. Some added applications for 114-26 B include, but are not limited to, emi/rfi shielding, polymer thick film circuitry, membrane switches and electrical static dissipation. 114-26 B is available in rolls ranging in widths up to 20 inches and lengths up to 2000 feet.

124-07-F is a B-staged, one part epoxy coating and laminating adhesive film. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. This product is available in thicknesses from 1 to 5 mils.

124-33-F is an electrically conductive, transferable, thermoplastic adhesive film. Some applications for the 125-33- F series include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembly of electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handleability. This product is available in thicknesses from 1 to 5 mils.

125-46A/B is an easy to use, 1 to 1 mix ratio, two part, heat cured, flexible, silver–filled epoxy adhesive used for making electrical and mechanical attachments on electrical components and devices. Unlike typical heat curing systems, this product always results in excellent conductivity and is less sensitive to handling and ambient conditions. The 125-46A/B is capable of being applied via syringe dispensing and is also capable of being dispensed via direct write and jetting systems, such as EFD's PicoDotTM jet dispenser. 125-46A/B is an economical version of 124-08A/B.Features Economical conductive epoxy adhesive

122-07-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 122- 07-F include, but are not limited to, die attach bonding, circuit board fabrication, advanced material composites, sealing, and high performance coatings. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils.Features Excellent Thermal Conductivity Easy Liner Release Excellent Chemical Resistance Low Ionics

118-06-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. The 118-06-F Series was developed with wafer manufacturing in mind. Some other applications for 118-06-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils (see product codes below). 118-06-F is designed with the performance criteria of Mil-Std-883 5011.4 in mind and is expected to pass ASTM E-595 outgassing testing when fully and properly cured.Features Excellent Electrical Conductivity. Easy Liner Release. Excellent Chemical Resistance. Low Ionics.

117-33 is a flexible, electrically conductive, silicone pressure sensitive adhesive. The overall balance of peel strength, cohesion, lap shear strength and high temperature holding power provides a versatility that makes this product useful in a wide range of fastening and bonding applications. This product is very resistant to flexing and creasing. Some applications for 117-33 include, polymer thick film circuitry, and electrical attachments for stress sensitive devices. 117-33 is one of the few conductive adhesives that can bond to silicone substrates and surfaces. In addition, it can be bonded to some types of Teflon® surfaces.Features High-temperature flexible conductive adhesive

125-22-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. Some applications for 125-22-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the Bstaged form. This product is available in thicknesses from 1 to 5 milsFeatures Excellent Electrical Conductivity Easy Liner Release Excellent Chemical Resistance Minimal Flow During Cure Low CTE Excellent High Temperature Performance

128-26 is a pourable, thermally conductive, silicone adhesive and potting compound suitable for application by stamping, screen printing, stencil printing, and syringe dispensing. This product features excellent adhesion to Kynar, Kapton, Mylar, glass, and a variety of other surfaces and is very resistant to flexing and creasing. Some applications for 128-26 include but are not limited to potting and encapsulation of stress-sensitive components, thermal management, and low-stress bonding applications.Features One Component thermally conductive heat cured adhesive.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

105-48 is a flexible, semi-conductive, silicone, pressure sensitive adhesive. The overall balance of peel strength, cohesion, lap shear strength and high temperature holding power provides a versatility that makes this product useful in a wide range of fastening and bonding applications. This product is very resistant to flexing and creasing. Some applications for 105-48 include, but are not limited to, electrostatic discharge, polymer thick film circuitry and membrane switches.Features Semi-conductive pressure-sensitive adhesive

102-32G1 is a flexible electrically conductive silicone adhesive. 102-32G1 features the highest degree of thermal and mechanical reliability over any other conductive adhesive technology and provides no failures during thermal cycling, heat aging, shocking or vibration due to the reliability from the elasticity of theproduct. Some applications for 102-32G1 include, but are not limited to, elastomeric conductive bridging and bonding, conductive bonding of low surface energy materials, conductive via filling and electrical attachments for stress sensitive devices. 102-32G1 is one of the few conductive adhesives that can bond to silicone substrates and surfaces. In addition, it can be bonded to some types of Teflon® surfaces. 102-32G1 features better conductivity than 102-32 when cured at lower temperatures

102-32D is a flexible, electrically conductive, silicone-based ink and adhesive. The overall balance of peel strength, cohesion, lap shear strength and high temperature holding power provides a versatility that makes this product useful in a wide range of fastening and bonding applications. This product is very resistant to flexing and creasing. Some applications for 102-32D include, but are not limited to, emi/rfi shielding of polyimide flexible circuits, polymer thick film circuitry, and electrical attachments for stress sensitive devices. 102-32D is one of the few conductive adhesives that can bond to silicone substrates and surfaces. In addition, it can be bonded to some types of Teflon® surfaces.Features Excellent Bonding to Difficult Surfaces. High Temperature Resistance. Wide Range of Applications.

126-37-F is an anisotropically conductive transferable low CTE adhesive film. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. This system features excellent thermal stability and flexibility in the B-Staged form. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. The product can be re-bonded many times by simply adding heat and slight pressure

904-64-4 is a two component, thermally conductive, high performance room temperature addition curing silicone.

126-22-F is an anisotropic conductive, solvent-resistant, transferable adhesive film. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern. This product is available in thicknesses from 1 to 5 mils