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Creative Materials 128-26

128-26 is a pourable, thermally conductive, silicone adhesive and potting compound suitable for application by stamping, screen printing, stencil printing, and syringe dispensing. This product features excellent adhesion to Kynar, Kapton, Mylar, glass, and a variety of other surfaces and is very resistant to flexing and creasing. Some applications for 128-26 include but are not limited to potting and encapsulation of stress-sensitive components, thermal management, and low-stress bonding applications.

Features

  • One Component thermally conductive heat cured adhesive.

Product Type: Encapsulant, Potting Compound

Application Area: Electrical Components

Compatible Substrates & Surfaces: Glass, Plastics, Polyimide

Application Method: Injection, Pour, Screen Coating

Chemical Family: Silicones

    Knowde Enhanced TDS

    Identification & Functionality

    Chemical Family

    Features & Benefits

    Applications & Uses

    Application Area
    Compatible Substrates & Surfaces

    Properties

    Physical Form
    Typical Cured Properties
    ValueUnitsTest Method / Conditions
    Viscosity60000cps
    Lap Shear Strength0.2MPa
    CTE80ppm/°C
    Thermal Conductivity3.4W/m-K
    Hydrolytic StabilityExcellent
    Useful Temperature Range-55 to 230ºC
    Thermal StabilityGood to 280°C

    Regulatory & Compliance

    Certifications & Compliance

    Safety & Health

    Safety & Handling
    • Contains flammable solvents.
    • Use with adequate ventilation.
    • Keep away from sparks and open flames.
    • Avoid prolonged contact with skin and breathing of vapors.
    • Wash with soap and water to remove from skin.

    Storage & Handling

    Suggested Handling And Curing

    128-26 is ready to use as supplied. Further thinning may be accomplished by adding small amounts of 113-12, xylene, or terpineol. Best properties, for most applications, result when cured for 60 minutes at 150°C. Good properties are obtained on a variety of substrates by dry and curing at temperatures ranging from 50°C to 180°C. End user is advised to experimentally determine temperature and time best suited for individual applications.