Products

102-12/B-187 is a black, two component, thermally conductive epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12/B-187 exhibits excellent thermal shock resistance and is especially suited to protecting sensitive electronic devices from a range of operating conditions including moisture, vibration, and temperature variation. Other useful applications include, but are not limited to, potting relays, electronic controls, sensors, and inverters and sealing of electronic component housings. Using B-187 allows for faster curing compared to B119-44.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.

The 811-64 System is a two component, high performance, room temperature curing, highly filled potting / encapsulating compound. 811-64 is the carbon filled version of 812-48.FeaturesTwo component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage.

904-64 is a two-component, thermally conductive, red, high performance room temperature addition curing siliconeFeaturesTwo component, easy air release and low shrinkage addition cured silicone potting compound

102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity

113-33 is a sag resistant black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 113-33 is an improved, sag resistant version of 102-11.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.

The 810-44-2 System is a two component (A + B) high performance, thermally conductive, room temperature curing epoxy adhesive and potting compound. This is a higher viscosity version of 810-44.FeaturesTwo component, low CTE, low flow epoxy adhesive.

102-11 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure resulting in a smooth, pinhole free surface. 102-11 is an improved, crack-resistant version of F947.Features Crack resistant, black, flame-out, epoxy compound. Room temperature cure, improved resistance to thermal cycling. Other properties similar to F947A/B.

Noelle 908-61 System is a medium hardness, gray, two components (A+B), high performance filled, room temperature or heat curing system. Noelle 908-61 System is designed for use in applications that requires a highly thermally conductive, shock resident, and cushion coat material for sensitive or fragile components or fine electrical wires.Features Two component gray thermally conductive silicone

102-11/B187 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-11 is an improved, crack resistance version of F947.Features Excellent resistance to thermal shock Longer pot life. Requires mild heat cure.

F940 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. Use B-187 when long pot life and higher heat resistance is desired.Features Low viscosity with long pot life. Requires mild heat cure.

111-27 is an electrically insulating coating and encapsulant suitable for application by spraying, dipping, syringe dispensing, pouring, and screen printing. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing when used as a coating. Some applications for 111-27 include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, environmental and humidity protection of surface mount components, insulating and diffusive layers of LEDs, and membrane switches. 111-27 also protects components from moisture, salts, and abrasion and features a high surface hardness with good toughness which reduces the risk of stress-fracturing bonded components. 111-27 is suitable for UV inspection.Features High dielectric strength coating

128-26 is a pourable, thermally conductive, silicone adhesive and potting compound suitable for application by stamping, screen printing, stencil printing, and syringe dispensing. This product features excellent adhesion to Kynar, Kapton, Mylar, glass, and a variety of other surfaces and is very resistant to flexing and creasing. Some applications for 128-26 include but are not limited to potting and encapsulation of stress-sensitive components, thermal management, and low-stress bonding applications.Features One Component thermally conductive heat cured adhesive.

904-64-4 is a two component, thermally conductive, high performance room temperature addition curing silicone.

F-947 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product cures at room temperature and is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface.Features Room temperature Improved heat resistance. Other properties similar to F940A/B.

813-04 is a one component, high performance, semiflexible, heat cured, epoxy encapsulant system. 813-04 has excellent heat resistance and electrical properties.Features One component thermally conductive semi-flexible epoxy

F-947 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. When used with curing agent B-187, cured product retains mechanical and electrical properties at operating temperatures up to 155°C.Features Excellent heat resistance Extended pot life. Requires mild heat cure.

F940 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface.Features Black, flame-out, epoxy potting and encapsulating compound. Low viscosity, self de-aerating, thermally conductive.