Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
- Product Families
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Product Highlights
- EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding.
- It is used highly in the medical, optical, and semiconductor industries.
- EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO.
- It is an excellent choice for semiconductor applications including capillary underfill or flip chip die attach.
Applications & Uses
- Applications
- Cure Method
- Instructions for Use
- Mix 100 grams of Resin (PART-A) to 100 grams of Hardener (PART-B) and mix it well preferably using a mechanical mixer.
- Vacuum degasses for five minutes to remove dissolved and entrapped air.
- Proceed with the bonding, casting or potting application and cure as recommended.
Properties
- Optical Properties
- Typical Cured Properties
- Handling Properties
| Value | Units | Test Method / Conditions | |
| Spectral Transmission (at 600nm) | min. 99 | % | — |
| Spectral Transmission (at 1000-1500nm) | min. 95 | % | — |
| Refractive Index (at 25°C, 589nm) | 1.52 | — | — |
| Value | Units | Test Method / Conditions | |
| Specific Gravity | 1.2 | — | — |
| Hardness | 92 | Shore D | — |
| Water Absorption (24 hours Submersion at 25°C) | 0.17 | % | — |
| Lap Shear Strength to Aluminium | 1500 | psi | — |
| Linear Shrinkage | 0.17 | % | — |
| Flexural Strength (Yield) | 13500 | psi | — |
| Flexural Modulus (Yield) | 3.2x10⁵ | psi | — |
| Service Temperature Range | -55 to 250 | °C | — |
| Glass Transition Temperature (Tg) | 110 | °C | — |
| Coefficient of Linear Thermal Expansion (Below Tg) | 59 | 10⁻⁶/°C | — |
| Coefficient of Linear Thermal Expansion (Above Tg) | min. 150 | 10⁻⁶/°C | — |
| Dielectric Strength | 450 | Volts/mil | — |
| Dielectric Constant (at 1 kHz) | 3.36 | — | — |
| Dielectric Constant (at 1 MHz) | 3.1 | — | — |
| Dissipation Factor (at 1 kHz) | 0.05 | — | — |
| Volume Resistivity | min. 1x10¹³ | ohm-cm | — |
| Value | Units | Test Method / Conditions | |
| Epoxibond | Part A | — | — |
| Hardener | Part B | — | — |
| Mix Ratio by Weight (Resin/Hardener) | 1:1 | — | — |
| Mix Ratio by Volume (Resin/Hardener) | 1:1 | — | — |
| Mixed Viscosity (at 25°C) | 200 - 300 | cps | — |
| Pot Life (at 25°C, 100 grams) | min. 12 | hours | — |
Regulatory & Compliance
- Certifications & Compliance
- Certification
USP Class VI Certified for Biocompatibility
Technical Details & Test Data
- Curing Information
- Recommended Cure : 2 hr at 80°C + 2 hr at 125°C
- Alternate Cure : 1 hr at 150°C
- Frozen Adhesive
Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.
Safety & Health
- Safety Information
- For Industrial Use Only : Practices of good housekeeping, safety and cleanliness should be followed before, during and after use
- Warning : Adequate ventilation of workplace and ovens is essential. Refer to Material Safety Data Sheet (MSDS) for additional health and safety information.
Packaging & Availability
- Packaging and Availability
- 2 parts Kit : Packaged in Pint, Quart, Gallon, and 5-Gal
- Premixed and frozen : Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C
Storage & Handling
- Shelf Life
- 1 Year
- Storage & Shelf Life
One year when stored in unopened containers at an average temperature of 25°C.