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MG Chemicals 8331D - Silver Conductive Epoxy Adhesive

8331D is an electrically conductive, silver-filled 2-part epoxy adhesive. It is smooth, non-sagging, thixotropic, and bonds well to a wide variety of substrates. This product allows for quick, cold-soldering repairs. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics. 8331D has been formulated to be economical. For a higher fill that maximizes conductivity, use 8330D. For a longer working time, time, use 8331S.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive

Application Area: Printed Electronics

Cure Method: Air Dry, Heat Cure

Compatible Substrates & Surfaces: Glass, Metal, Plastics

Application Method: Injection

Chemical Family: Epoxy & Epoxy Derivatives, Silver & Silver Compounds

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Identification & Functionality

Features & Benefits

Labeling Claims
Key Attributes
  • Creates strong permanent electrical connections
  • Cures at room temperature
  • SVHC free
  • Excellent adhesion to many substrates
  • Room temperature storage
  • Long shelf life
Syringe
  1. Twist and remove the cap from the syringe. Do not discard cap.
  2. Measure 1 part by volume of A.
  3. Measure 1 part by volume of B.
  4. Dispense material on a mixing surface or container, and thoroughly mix parts A and B together.
  5. To stop the flow, pull back on the plunger.
  6. Clean nozzle to prevent contamination and material buildup.
  7. Replace the cap on the syringe.
Can or Jar
  1. Stir each part individually to re-incorporate material that may have separated.
  2. Measure 1.1 part by weight of A.
  3. Measure 1 part by weight of B.
  4. Thoroughly mix parts A and B together.
  5. Apply adhesive to the application area.
Recommended Preparation
Clean the substrate with Isopropyl Alcohol, MG #824, so the surface is free of oils, dust, and other residues.

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces
Cure Instructions

The product will not cure at room temperature. Cure the adhesive in an oven at one of these time/temperature options:

  • 10 min at 65 ˚C
  • 5 min at 80 ˚C

Properties

Physical Form
Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Conductivity (at 25 ˚C)1.5W/(m·K)
Typical Properties
ValueUnitsTest Method / Conditions
Mix Ratio1:1Volume
Mix Ratio1.1:1Weight
Service Cure65Minutes
Viscosity (at 25 ˚C)130Pa·s
Working Time20Minutes
Cured Properties
ValueUnitsTest Method / Conditions
Compressive Strength69N/mm2
CTE After Tg234ppm/˚C
CTE Prior Tg58ppm/˚C
Glass Transition Temperature (Tg)35˚C
Hardness Shore D78
Lap Shear (Aluminum)5.1N/mm2
Lap Shear (Stainless steel)5.6N/mm2
Resistivity1.0 x 10⁻³Ω·cm
Service Temperature Range-50 to 150˚C
Tensile Strength13N/mm2
Uncured Properties
ValueUnitsTest Method / Conditions
Mixed Density2.4g/mL

Regulatory & Compliance

Chemical Inventories

Packaging & Availability

Packaging Type

Storage & Handling

Shelf Life
3 Years