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MG Chemicals 9410 - 1 Part Epoxy, Electrically Conductive Adhesive, High Tg

9410 is a 1-part electrically conductive epoxy adhesive. It has unlimited working time at room temperature. It bonds well to a wide variety of substrates, and offers strong chemical resistance. 9410 is designed for semi-conductor flip chip packaging as well as die attach for small chips, LEDs and diodes. It provides excellent EMI/RFI shielding and is very effective at filling in seams between metal plates. It can be readily used in manual, pneumatic and robotic dispensing processes.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive

Application Area: Die/Chip Attach, LEDs, Semiconductors

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Metal, Stainless Steel

Application Method: Injection

Chemical Family: Epoxides

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Identification & Functionality

Chemical Family

Features & Benefits

Key Attributes
  • Creates strong permanent electrical connections
  • No mixing and unlimited working time
  • Low cure temperature of 90 °C
  • Room temperature storage
  • Suitable for automated dispensing

Applications & Uses

Application Method
Compatible Substrates & Surfaces
Cure Method
Recommended Preparation

Clean the substrate with Isopropyl Alcohol, MG #824, so the surface is free of oils, dust, and other residues.

Syringe or Cartridge

  • Twist and remove the cap from the cartridge or syringe. Do not discard cap.
  • Dispense the adhesive evenly to both surfaces.
    • For 30 mL size, insert the cartridge in the 8DG-30-1 dispensing gun (see Dispensing Accessories Application Guide).
  • To stop the flow, pull back on the plunger.
  • Clean nozzle to prevent contamination and material buildup.
  • Replace the cap on the cartridge or syringe.

Dispensing Accessories

Consult the table below for accessory selection. See the Dispensing Accessories Application Guide for usage instructions.

Cat. No. Dispensing Gun Static Mixer
9410-3ML N/A N/A
9410-30ML 8DG-30-1 N/A

Properties

Physical Form
Physical Properties
ValueUnitsTest Method / Conditions
Density2.34g/mL
Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Conductivity (at 25 ˚C)1.1W/(m·K)
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25 ˚C)Thixotropic paste
Cured Properties
ValueUnitsTest Method / Conditions
Resistivity1.8 x 10⁻³Ω·cm
Hardness Shore D70
Compressive Strength26N/mm2
Lap Shear (Stainless steel)2.6N/mm2
Lap Shear (Aluminum)2.8N/mm2
Glass Transition Temperature (Tg)96˚C
CTE Prior Tg42ppm/˚C
CTE After Tg150ppm/˚C
Service Temperature Range-65 to 145˚C

Regulatory & Compliance

Quality Standards

Technical Details & Test Data

Cure Instructions

The product will not cure at room temperature. Cure the adhesive in an oven at one of these time/temperature options:

  • 1 h @ 90 ˚C
  • 30 min @ 100 ˚C
  • 7 min @ 150 ˚C
Usage Parameters
Working Time Unlimited
Cure Times 1 h @ 90 ˚C
30 min @ 100 ˚C
7 min @ 150 ˚C

Packaging & Availability

Packaging Type
Packaging and Supporting Products
Cat. No. Packaging Net Volume Net Weight
9410-3ML Syringe 3 mL 7.00 g
9410-30ML Cartridge 30 mL 70.0 g

Storage & Handling

Temperature Ranges

Store in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when not in use and keep frozen. If exposed to freezing temperatures, keep product at room temperature for 2 hours prior to use.

9410-3ML and 9410-30ML
Shelf Life @ 22 ˚C 4 months
Shelf Life @ -10 ˚C 12 months