Products

Highly Conductive Silver Coating for EMI Shielding Semiconductor Packages 842UR is a 1-part, heat-cured, silver polyurethane coating. It is a smooth, flexible coating that provides excellent electrical conductivity at a low film thickness. It maintains flexibility at low temperatures, provides exceptional adhesion to a wide variety of substrates, and provides excellent environmental stability. 842UR is designed for large volume board-level or package-level EMI shielding applications. It can replace traditional metal lid, which reduces cost, board thickness, and mass.

9310 is a 1-part, fast curing, electrically insulative epoxy adhesive. It is a smooth, thixotropic paste that stays in place without tailing when dispensed. This surface mount adhesive is specially designed for die attach applications in electronics assembly operations. It can be readily used in manual, pneumatic and robotic dispensing processes. It can also be used as a general-purpose adhesive for household, industrial and manufacturing applications. It has an unlimited working life at room temperature and does not require mixing or frozen storage.

RTV162 adhesive sealants from Momentive Performance Materials are one-component, ready-to-use electronic grade silicone sealants. They cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature. These electronic-grade silicone adhesive sealants differ somewhat in physical properties including consistency.

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

8329TFF is a 2-part, flame retardant, thermally conductive epoxy adhesive with a 5-minute working time. It is an off white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal glue is often used to bond heatsinks to CPUs, LEDs and other electronics components. This product has a very short working time. For a longer working time, use 8349TFM or 8329TFS.

8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.

8329TFM is a thermally conductive two-part epoxy adhesive. It is dark gray, smooth, thixotropic, and bonds well to a wide variety of substrates. This product is used to bond heat sinks, LEDs, and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips, and automatic dispensing systems. For a faster working life, use 8329TFF. For a longer working life, use 8329TFS.

9460TC is a 1-part, heat cured only, thermally conductive epoxy adhesive with an unlimited working time. It is an off-white, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This 1-part adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. It does not require mixing and is suitable for use with manual, pneumatic, and automatic dispensing systems.

9400 is an electrically conductive, silver-filled, 1-part epoxy adhesive with a low cure temperature. It is smooth, thixotropic, non-sagging, and bonds well to a wide variety of substances. It has an unlimited working life at room temperature. This product can create electrically conductive bonds where soldering is not an option, such as when bonding to heat-sensitive components, glass, soft metals, or conductive polymers. It also works well in semi-conductor packaging, microelectronic attachment and lid-sealing, and as a die attach for small chips, LEDs and diodes. It does not require mixing and can be readily used in manual, pneumatic and robotic dispensing processes. 9400 has been formulated to have a low Tg, which allows for minimal stress on substrates during temperature changes. For a higher Tg, use 9410.

RTV167 adhesive sealants from Momentive Performance Materials are one-component, ready-to-use electronic grade silicone sealants. They cure to a tough, resilient silicone rubber on exposure to atmospheric moisture at room temperature. These electronic-grade silicone adhesive sealants differ somewhat in physical properties including consistency.

9410 is a 1-part electrically conductive epoxy adhesive. It has unlimited working time at room temperature. It bonds well to a wide variety of substrates, and offers strong chemical resistance. 9410 is designed for semi-conductor flip chip packaging as well as die attach for small chips, LEDs and diodes. It provides excellent EMI/RFI shielding and is very effective at filling in seams between metal plates. It can be readily used in manual, pneumatic and robotic dispensing processes.

8329TCS is a 2-part, heat-cure, thermally conductive epoxy adhesive with a 4-hour working time. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This thermal adhesive is used to glue heat sinks to LEDs, CPUs and other heat-generating components. 8329TCS has been designed for maximum thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity, use 8329TFS. For a shorter working time, use 8329TCM.