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Semitron® MPR-1000

1 of 12 products in this brand
Semitron® MPR 1000 - an advanced engineering material that is specially developed for use in the semiconductor and electronics industry. This material boasts excellent heat resistance and low erosion rates in plasma chambers, making it a top choice for vacuum chamber applications such as etch, CVD, and ion implant.Features:Longevity: Increased life in plasma chambers (up to 25X over polyimide in ozone)Clean: Low ionic metal content and low out-gassingValue: Lower overall cost in use compared to traditional materials used in vacuum chamber applications such as quartz, ceramics, and engineering plasticsBenefits:Long-lasting performance in plasma-based vacuum chambersLow maintenance and cost-effective solutionClean and efficient, suitable for semiconductor and electronics industryApplications:Clamp ringsTrench ringsScrewsPinsShower headsCentering pinsFocus ringsInsulatorsVacuum padsWafer guidesSemitron® MPR 1000 is a versatile material that is ideal for use in vacuum chamber applications within the semiconductor and electronics industry. With its outstanding heat resistance and low erosion rates, this material is a cost-effective and efficient solution that ensures longevity and clean performance in plasma-based vacuum chambers.

Polymer Name: Polyamide-imide (PAI)

Physical Form: Plates, Rods

Features: Chipping Resistance, Good Machinability, High Durability, High Tolerance, Low Outgassing, Very Good Heat Resistance

Density: 1470.0 - 1470.0 kg/m³

Tensile Modulus: 6050.0 - 6050.0 MPa

Color: Brown, Yellow

Technical Data Sheet

Knowde Enhanced TDS

Identification & Functionality

Chemical Family
Technologies

Features & Benefits

Product Benefits
  • Enhanced PAI formula
  • Low ionic content & low out- gassing
  • Excellent heat resistance
  • Minimized rate of erosion in plasma chambers
  • Optimal chip resistance, durability, and machinability
  • Designed specifically for demanding chamber applications
Clean, Resistant and Optimized Material Solution for Vacuum Chambers

The product shows increased lifetime over traditional materials such as polyimide, for example up to 25x over polyimide in ozone in some cases, and is often specified against traditional materials used in vacuum chamber applications such as quartz, ceramics, polyimides and other engineering plastics, as MPR1000 lasts much longer over time.

Product Details

The material was developed based on three key premises:

  • Longevity - Increased life in plasma chambers over traditional plastics such as polyimide (up to 25X over polyimide in ozone)
  • Clean - Low ionic metal content and low out-gassing
  • Value - Lower overall cost in use compared to traditional materials used in vacuum chamber applications such as quartz, ceramics, and engineering plastics

Applications & Uses

Product Applications
  • Vacuum chambers that utilize oxygen plasma
  • Clamp rings, trench rings, hangers, screw pins, and shower heads
  • Centering pins, focus rings, insulators, vacuum pads, and wafer guides

Properties

Flame Rating
Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength99MPaISO 527-1/-2
Tensile Strain (Elongation) at Break3.5%ISO 527-1/-2
Tensile Modulus of Elasticity6050MPaISO 527-1/-2
Shear Strength83MPaASTM D732
Compressive Stress (1 / 2 / 5 % Nominal Strain)47/ 79/ 130MPaISO 604
Charpy Impact Strength (Unnotched)62kJ/m²ISO 179-1/1eU
Charpy Impact Strength (Notched)5kJ/m²ISO 179-1/1eA
Hardness102Rockwell MISO 2039-2
Thermal Properties
ValueUnitsTest Method / Conditions
Glass Transition Temperature (DMA, Tan Delta)277°CDMA
Thermal Conductivity (23°C)0.5W/(K.m)
Coefficient of Linear Thermal Expansion (23 - 60°C)29µm/(m.K)
Coefficient of Linear Thermal Expansion (23 - 100°C)30µm/(m.K)
Coefficient of Linear Thermal Expansion (min. 150°C)36µm/(m.K)
Heat Deflection Temperature (Method A: 1.8 MPa (264 PSI))278°CISO 75-1/-2
Continuous Allowable Service Temperature in Air (20.000 hrs)260°C
Flammability: (3 mm (1/8 in.))V-0UL 94
Miscellaneous Properties
ValueUnitsTest Method / Conditions
Density1.47g/cm³ISO 1183-1
Water Absorption (After 24h Immersion in Water of 23°C)0.28%ISO 62
Water Absorption (At Saturation in Water of 23 °C)3.4%

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Percent Weight Loss in Oxygen Plasma - Lower Energy

Semitron® MPR-1000 - Percent Weight Loss in Oxygen Plasma - Lower Energy

Semitron® MPR1000 has less than 0.5% erosion in 1KW O2, 13x better than PI